TEM-EDX observations of the microstructure of electrodeposited Ni-Sn alloys

Satoshi Oue, Hiroaki Nakano, Ryo Kuroda, Shigeo Kobayashi, Hisaaki Fukushima

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    9 Citations (Scopus)


    The microstructure of Ni-Sn alloys electrodeposited at 50-5000 A/m 2 from 65°C chloride solutions containing 5-40 metal% of Sn were analyzed by TEM-EDX. Ni-Sn alloy deposition showed a characteristic behavior in that Ni and Sn were codeposited at an atomic ratio of 1:1 under a wide range of solution compositions and current densities. Ni and Sn EDX mapping images of a cross section of Ni-50 at% Sn alloy deposited at over 1000 A/m 2 showed a lamellar pattern parallel to the interface between substrate and deposit, indicating the alternate deposition of Ni-Sn alloys with different compositions. The Ni-Sn alloys were identified by EDX line analysis as Ni 3Sr 4 and Ni 3Sn 2. It was concluded that Ni-50 at%Sn alloys deposited over 1000 A/m 2 were not composed of the previously reported metastable-phase NiSn single alloy, but instead consisted of both Ni 3Sn 2 and Ni 3Sn 2 alloys in a thermodynamically stable phase.

    Original languageEnglish
    Pages (from-to)1550-1554
    Number of pages5
    JournalMaterials Transactions
    Issue number6
    Publication statusPublished - Jun 2006

    All Science Journal Classification (ASJC) codes

    • General Materials Science
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering


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