TY - JOUR
T1 - Surface reaction kinetics of CH3 in CH4 RF discharge studied by time-resolved threshold ionization mass spectrometry
AU - Shiratani, Masaharu
AU - Jolly, Jacques
AU - Videlot, Hervé
AU - Perrin, Jérôme
PY - 1997/7
Y1 - 1997/7
N2 - The surface loss probability β of CH3 radicals on a-C:H surface is determined by time-resolved threshold ionization mass spectrometry in pulsed RF discharges. In the post-discharge, the β value decreases from 0.011-0.015 to 0.001-0.002 in about 10ms. This time evolution suggests that the loss probability depends on incoming ion and radical fluxes on the surface. We present a simple model of the surface reaction kinetics in which the number of active chemisorption sites on the surface is determined by the balance between their production, due to ions and/or H, and their annihilation, due to CH3 radicals. The model describes fairly well the observed decay of the CH3 radical density and the time evolution of β determined experimentally in the afterglow. The maximum contribution of the CH3 radicals to the deposition rate of a-C:H films was deduced to be about 60% of the total deposition rate determined experimentally.
AB - The surface loss probability β of CH3 radicals on a-C:H surface is determined by time-resolved threshold ionization mass spectrometry in pulsed RF discharges. In the post-discharge, the β value decreases from 0.011-0.015 to 0.001-0.002 in about 10ms. This time evolution suggests that the loss probability depends on incoming ion and radical fluxes on the surface. We present a simple model of the surface reaction kinetics in which the number of active chemisorption sites on the surface is determined by the balance between their production, due to ions and/or H, and their annihilation, due to CH3 radicals. The model describes fairly well the observed decay of the CH3 radical density and the time evolution of β determined experimentally in the afterglow. The maximum contribution of the CH3 radicals to the deposition rate of a-C:H films was deduced to be about 60% of the total deposition rate determined experimentally.
UR - http://www.scopus.com/inward/record.url?scp=0031177619&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0031177619&partnerID=8YFLogxK
U2 - 10.1143/jjap.36.4752
DO - 10.1143/jjap.36.4752
M3 - Article
AN - SCOPUS:0031177619
SN - 0021-4922
VL - 36
SP - 4752
EP - 4755
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
IS - 7 SUPPL. B
ER -