Surface protection of copper by self assembled monolayer for low-temperature chip bonding

Lijing Qiu; Kiyoaki Nakahara; Akihiro Ikeda; Tanemasa Asano

doi:10.1109/LTB-3D.2012.6238050

Surface protection of copper by self assembled monolayer for low-temperature chip bonding

Lijing Qiu, Kiyoaki Nakahara, Akihiro Ikeda, Tanemasa Asano

Integrated Electronic Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

To protect the surface of electroplated Cu from contamination such as oxidation, coating of the surface with a self-assembled monolayer (SAM) was investigated. The coating material investigated was 1-Hexanethiol. Auger electron spectroscopy showed that the SAM coating definitely reduced the oxidation rate of the Cu surface. Change in surface contamination with elevating temperature in the ambient was investigated by measuring wetting angle of water. It showed that the surface protection is kept up to about 100C. Also, we applied this coating to Cu cone-shaped bump.

Original language	English
Title of host publication	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Pages	75-78
Number of pages	4
DOIs	https://doi.org/10.1109/LTB-3D.2012.6238050
Publication status	Published - 2012
Event	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan Duration: May 22 2012 → May 23 2012

Publication series

Name	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Other

Other	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Country/Territory	Japan
City	Tokyo
Period	5/22/12 → 5/23/12

All Science Journal Classification (ASJC) codes

Computer Graphics and Computer-Aided Design
Computer Vision and Pattern Recognition

Access to Document

10.1109/LTB-3D.2012.6238050

Cite this

Qiu, L., Nakahara, K., Ikeda, A., & Asano, T. (2012). Surface protection of copper by self assembled monolayer for low-temperature chip bonding. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 (pp. 75-78). Article 6238050 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). https://doi.org/10.1109/LTB-3D.2012.6238050

Surface protection of copper by self assembled monolayer for low-temperature chip bonding. / Qiu, Lijing; Nakahara, Kiyoaki; Ikeda, Akihiro et al.
Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 75-78 6238050 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Qiu, L, Nakahara, K, Ikeda, A & Asano, T 2012, Surface protection of copper by self assembled monolayer for low-temperature chip bonding. in Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012., 6238050, Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, pp. 75-78, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, Tokyo, Japan, 5/22/12. https://doi.org/10.1109/LTB-3D.2012.6238050

Qiu L, Nakahara K, Ikeda A, Asano T. Surface protection of copper by self assembled monolayer for low-temperature chip bonding. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 75-78. 6238050. (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). doi: 10.1109/LTB-3D.2012.6238050

Qiu, Lijing ; Nakahara, Kiyoaki ; Ikeda, Akihiro et al. / Surface protection of copper by self assembled monolayer for low-temperature chip bonding. Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. pp. 75-78 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

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abstract = "To protect the surface of electroplated Cu from contamination such as oxidation, coating of the surface with a self-assembled monolayer (SAM) was investigated. The coating material investigated was 1-Hexanethiol. Auger electron spectroscopy showed that the SAM coating definitely reduced the oxidation rate of the Cu surface. Change in surface contamination with elevating temperature in the ambient was investigated by measuring wetting angle of water. It showed that the surface protection is kept up to about 100C. Also, we applied this coating to Cu cone-shaped bump.",

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AB - To protect the surface of electroplated Cu from contamination such as oxidation, coating of the surface with a self-assembled monolayer (SAM) was investigated. The coating material investigated was 1-Hexanethiol. Auger electron spectroscopy showed that the SAM coating definitely reduced the oxidation rate of the Cu surface. Change in surface contamination with elevating temperature in the ambient was investigated by measuring wetting angle of water. It showed that the surface protection is kept up to about 100C. Also, we applied this coating to Cu cone-shaped bump.

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Surface protection of copper by self assembled monolayer for low-temperature chip bonding

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