Surface metallization on high temperature liquid-crystal-polymer film by uv-irradiation process

Takeharu Sugiyama; Yosuke Iimori; Kunihiro Baba; Mitsuhiro Watanabe; Hideo Honma

doi:10.1149/1.3156638

Surface metallization on high temperature liquid-crystal-polymer film by uv-irradiation process

Takeharu Sugiyama, Yosuke Iimori, Kunihiro Baba, Mitsuhiro Watanabe, Hideo Honma

Research output: Contribution to journal › Article › peer-review

15 Citations (Scopus)

Abstract

A highly adherent Cu-Ni-P film was successfully grown on a UV-irradiated liquid-crystal-polymer (LCP) film. Irradiation from a UV light under an atmospheric condition created hydrophilic nanometer-scale roughness on the LCP film surface by introducing hydrophilic groups on the surface. The high adhesion strength of more than 0.8 kN/m was obtained because of the anchoring effect of the nanometer-scale roughness developed at the interface between the deposited metal and the LCP film. Copper circuit patterns formed on the LCP film showed satisfactory performance for various reliability tests. Fine circuit formation and selective plating facilitated by UV irradiation could lead to a manufacturing approach for the next generation of flexible-printed-circuit technology.

Original language	English
Pages (from-to)	D360-D363
Journal	Journal of the Electrochemical Society
Volume	156
Issue number	9
DOIs	https://doi.org/10.1149/1.3156638
Publication status	Published - 2009
Externally published	Yes

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Renewable Energy, Sustainability and the Environment
Surfaces, Coatings and Films
Electrochemistry
Materials Chemistry

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This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1149/1.3156638

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abstract = "A highly adherent Cu-Ni-P film was successfully grown on a UV-irradiated liquid-crystal-polymer (LCP) film. Irradiation from a UV light under an atmospheric condition created hydrophilic nanometer-scale roughness on the LCP film surface by introducing hydrophilic groups on the surface. The high adhesion strength of more than 0.8 kN/m was obtained because of the anchoring effect of the nanometer-scale roughness developed at the interface between the deposited metal and the LCP film. Copper circuit patterns formed on the LCP film showed satisfactory performance for various reliability tests. Fine circuit formation and selective plating facilitated by UV irradiation could lead to a manufacturing approach for the next generation of flexible-printed-circuit technology.",

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T1 - Surface metallization on high temperature liquid-crystal-polymer film by uv-irradiation process

AU - Sugiyama, Takeharu

AU - Iimori, Yosuke

AU - Baba, Kunihiro

AU - Watanabe, Mitsuhiro

AU - Honma, Hideo

PY - 2009

Y1 - 2009

N2 - A highly adherent Cu-Ni-P film was successfully grown on a UV-irradiated liquid-crystal-polymer (LCP) film. Irradiation from a UV light under an atmospheric condition created hydrophilic nanometer-scale roughness on the LCP film surface by introducing hydrophilic groups on the surface. The high adhesion strength of more than 0.8 kN/m was obtained because of the anchoring effect of the nanometer-scale roughness developed at the interface between the deposited metal and the LCP film. Copper circuit patterns formed on the LCP film showed satisfactory performance for various reliability tests. Fine circuit formation and selective plating facilitated by UV irradiation could lead to a manufacturing approach for the next generation of flexible-printed-circuit technology.

AB - A highly adherent Cu-Ni-P film was successfully grown on a UV-irradiated liquid-crystal-polymer (LCP) film. Irradiation from a UV light under an atmospheric condition created hydrophilic nanometer-scale roughness on the LCP film surface by introducing hydrophilic groups on the surface. The high adhesion strength of more than 0.8 kN/m was obtained because of the anchoring effect of the nanometer-scale roughness developed at the interface between the deposited metal and the LCP film. Copper circuit patterns formed on the LCP film showed satisfactory performance for various reliability tests. Fine circuit formation and selective plating facilitated by UV irradiation could lead to a manufacturing approach for the next generation of flexible-printed-circuit technology.

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Surface metallization on high temperature liquid-crystal-polymer film by uv-irradiation process

Abstract

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