TY - GEN
T1 - Studies of underfill formulation effects using molecular dynamics and discrete element modeling
AU - Iwamoto, N.
AU - Li, M.
AU - McCaffery, S. J.
AU - Nakagawa, M.
AU - Mustoe, G.
N1 - Publisher Copyright:
© 1998 IEEE.
PY - 1998
Y1 - 1998
N2 - The underfill phenomenon is driven by many dynamic interactions which can be studied from a fundamental standpoint. Although capillary action generally drives the filling phenomenon, it is the underlying principles that govern the underfill performance properties which must be understood. For instance, flow speed, filler settling, filler striation and voiding are all properties that require mechanistic understanding. Although binder and filler effects are expected from a combination of surface energy and particle dynamics drivers, the simple identification of the problem does not instruct on how to control these effects; and for the formulator or the end-use engineer, such understanding must be reduced to controllable variables. In order to address these issues, both molecular modeling and discrete element modeling have been used to understand the formulation constituent effects.
AB - The underfill phenomenon is driven by many dynamic interactions which can be studied from a fundamental standpoint. Although capillary action generally drives the filling phenomenon, it is the underlying principles that govern the underfill performance properties which must be understood. For instance, flow speed, filler settling, filler striation and voiding are all properties that require mechanistic understanding. Although binder and filler effects are expected from a combination of surface energy and particle dynamics drivers, the simple identification of the problem does not instruct on how to control these effects; and for the formulator or the end-use engineer, such understanding must be reduced to controllable variables. In order to address these issues, both molecular modeling and discrete element modeling have been used to understand the formulation constituent effects.
UR - http://www.scopus.com/inward/record.url?scp=84889149963&partnerID=8YFLogxK
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U2 - 10.1109/ADHES.1998.742048
DO - 10.1109/ADHES.1998.742048
M3 - Conference contribution
AN - SCOPUS:84889149963
T3 - Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998
SP - 321
EP - 327
BT - Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, ADHES 1998
Y2 - 28 September 1998 through 30 September 1998
ER -