TY - JOUR
T1 - Strengthening of Cu-Ni-Si alloy using high-pressure torsion and aging
AU - Lee, Seungwon
AU - Matsunaga, Hirotaka
AU - Sauvage, Xavier
AU - Horita, Zenji
N1 - Funding Information:
One of the authors (ZH) would like to thank the University of Rouen for having an opportunity to participate in the international invited program and carry out the APT analyses. This work was supported in part by a Grant-in-Aid for Scientific Research from the MEXT, Japan , in Innovative Areas “Bulk Nanostructured Metals” ( 22102004 ) and in part by Kyushu University Interdisciplinary Programs in Education and Projects in Research Development (P&P) .
PY - 2014/4
Y1 - 2014/4
N2 - An age-hardenable Cu-2.9%Ni-0.6%Si alloy was subjected to high-pressure torsion. Aging behavior was investigated in terms of hardness, electrical conductivity and microstructural features. Transmission electron microscopy showed that the grain size is refined to ~ 150 nm and the Vickers microhardness was significantly increased through the HPT processing. Aging treatment of the HPT-processed alloy led to a further increase in the hardness. Electrical conductivity is also improved with the aging treatment. It was confirmed that the simultaneous strengthening by grain refinement and fine precipitation is achieved while maintaining high electrical conductivity. Three dimensional atom probe analysis including high-resolution transmission electron microscopy revealed that nanosized precipitates having compositions of a metastable Cu 3Ni5Si2 phase and a stable NiSi phase were formed in the Cu matrix by aging of the HPT-processed samples and these particles are responsible for the additional increase in strength after the HPT processing.
AB - An age-hardenable Cu-2.9%Ni-0.6%Si alloy was subjected to high-pressure torsion. Aging behavior was investigated in terms of hardness, electrical conductivity and microstructural features. Transmission electron microscopy showed that the grain size is refined to ~ 150 nm and the Vickers microhardness was significantly increased through the HPT processing. Aging treatment of the HPT-processed alloy led to a further increase in the hardness. Electrical conductivity is also improved with the aging treatment. It was confirmed that the simultaneous strengthening by grain refinement and fine precipitation is achieved while maintaining high electrical conductivity. Three dimensional atom probe analysis including high-resolution transmission electron microscopy revealed that nanosized precipitates having compositions of a metastable Cu 3Ni5Si2 phase and a stable NiSi phase were formed in the Cu matrix by aging of the HPT-processed samples and these particles are responsible for the additional increase in strength after the HPT processing.
UR - http://www.scopus.com/inward/record.url?scp=84893984112&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84893984112&partnerID=8YFLogxK
U2 - 10.1016/j.matchar.2014.01.006
DO - 10.1016/j.matchar.2014.01.006
M3 - Article
AN - SCOPUS:84893984112
SN - 1044-5803
VL - 90
SP - 62
EP - 70
JO - Materials Characterization
JF - Materials Characterization
ER -