Solidification of Sn-0.7Cu-0.15Zn solder: In situ observation

Guang Zeng, Stuart D. McDonald, Christopher M. Gourlay, Kentaro Uesugi, Yasuko Terada, Hideyuki Yasuda, Kazuhiro Nogita

Research output: Contribution to journalArticlepeer-review

23 Citations (Scopus)


High resolution time-resolved X-ray imaging with synchrotron radiation was used for in situ observation of four distinct events during solidification of a Sn-0.7Cu-0.15Zn solder despite small composition and density differences. These included bSn dendrite growth, Sn-Cu6Sn5 univariant eutectic growth, microporosity formation, and a polyphase reaction in the last stages of freezing. The development of microstructure was described quantitatively by tracking the loci of dendrite tips during grain growth. The results have implications for microstructure control and the understanding of structure-property relationships in Sn-Cu-Zn lead-free solders.

Original languageEnglish
Pages (from-to)918-926
Number of pages9
JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Issue number2
Publication statusPublished - Feb 2014
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys


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