Abstract
A new MOSFET which has a built-in bipolar operation mechanism at the drain region has been fabricated using a bond-and-lap technique to form a silicon on insulator (SOI) structure. The results show that the merged transistors increase the transconductance by 15 times for a pMOS/npn transistor and by 60 times for an nMOS/pnp transistor as compared with conventional MOSFETs.
Original language | English |
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Pages (from-to) | 1203-1204 |
Number of pages | 2 |
Journal | Electronics Letters |
Volume | 35 |
Issue number | 14 |
DOIs | |
Publication status | Published - Jul 8 1999 |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering