Simulation of particle compaction for conductive adhesives using discrete element modeling

G. G.W. Mustoe; M. Nakagawa; X. Lin; N. Iwamoto

Simulation of particle compaction for conductive adhesives using discrete element modeling

G. G.W. Mustoe, M. Nakagawa, X. Lin, N. Iwamoto

Research output: Contribution to journal › Conference article › peer-review

Abstract

Johnson-Matthey and Colorado School of Mines collaborated on the simulation of compaction in conductive die attach adhesives using Discrete Element Modeling (DEM). It was found that by using DEM, both particle shape and distribution may be simulated to derive an overall picture of the settled or compacted state of the material.

Original language	English
Pages (from-to)	353-359
Number of pages	7
Journal	Proceedings - Electronic Components and Technology Conference
Publication status	Published - 1999
Externally published	Yes
Event	Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA Duration: Jun 1 1999 → Jun 4 1999

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Cite this

@article{608b56e59aa747fb950aa5921bab7020,

title = "Simulation of particle compaction for conductive adhesives using discrete element modeling",

abstract = "Johnson-Matthey and Colorado School of Mines collaborated on the simulation of compaction in conductive die attach adhesives using Discrete Element Modeling (DEM). It was found that by using DEM, both particle shape and distribution may be simulated to derive an overall picture of the settled or compacted state of the material.",

author = "Mustoe, {G. G.W.} and M. Nakagawa and X. Lin and N. Iwamoto",

year = "1999",

language = "English",

pages = "353--359",

journal = "Proceedings - Electronic Components and Technology Conference",

issn = "0569-5503",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) ; Conference date: 01-06-1999 Through 04-06-1999",

}

TY - JOUR

T1 - Simulation of particle compaction for conductive adhesives using discrete element modeling

AU - Mustoe, G. G.W.

AU - Nakagawa, M.

AU - Lin, X.

AU - Iwamoto, N.

PY - 1999

Y1 - 1999

N2 - Johnson-Matthey and Colorado School of Mines collaborated on the simulation of compaction in conductive die attach adhesives using Discrete Element Modeling (DEM). It was found that by using DEM, both particle shape and distribution may be simulated to derive an overall picture of the settled or compacted state of the material.

AB - Johnson-Matthey and Colorado School of Mines collaborated on the simulation of compaction in conductive die attach adhesives using Discrete Element Modeling (DEM). It was found that by using DEM, both particle shape and distribution may be simulated to derive an overall picture of the settled or compacted state of the material.

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UR - http://www.scopus.com/inward/citedby.url?scp=0032690794&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0032690794

SN - 0569-5503

SP - 353

EP - 359

JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

T2 - Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC)

Y2 - 1 June 1999 through 4 June 1999

ER -

Simulation of particle compaction for conductive adhesives using discrete element modeling

Abstract

All Science Journal Classification (ASJC) codes

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