Simulating underfill flow for microelectronics packaging

N. Iwamoto, M. Nakagawa, G. G.W. Mustoe

Research output: Contribution to journalConference articlepeer-review

10 Citations (Scopus)


Two types of dynamic modeling are initiated to understand formulation constituent effects. The two modeling types include molecular modeling and discrete element modeling. Through this modelling effort, a basic model of underfill flow which includes particle, binder (or carrier) and surface effects is constructed.

Original languageEnglish
Pages (from-to)294-301
Number of pages8
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - 1999
Externally publishedYes
EventProceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA
Duration: Jun 1 1999Jun 4 1999

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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