TY - GEN
T1 - Room temperature microjoining of qVGA class area-bump array using cone bump
AU - Shuto, Takanori
AU - Iwanabe, Keiichiro
AU - Qiu, Li Jing
AU - Asano, Tanemasa
PY - 2012
Y1 - 2012
N2 - We show that room temperature microjoining a 332 x 268 array of bumps can be realized by using ultrasonic bonding of cone-shaped microbump. 20 μm-pitch area array of cone-shaped Au bump was fabricated on a Si wafer by using a photolithography and electroplating. A flat planar electrode made of electoplated Au was used as the counter electrode. Ultrasonic bonding was carried out at room temperature in ambient air. Electrical connection test shows all bump connections with low resistance have been achieved.
AB - We show that room temperature microjoining a 332 x 268 array of bumps can be realized by using ultrasonic bonding of cone-shaped microbump. 20 μm-pitch area array of cone-shaped Au bump was fabricated on a Si wafer by using a photolithography and electroplating. A flat planar electrode made of electoplated Au was used as the counter electrode. Ultrasonic bonding was carried out at room temperature in ambient air. Electrical connection test shows all bump connections with low resistance have been achieved.
UR - http://www.scopus.com/inward/record.url?scp=84879753143&partnerID=8YFLogxK
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U2 - 10.1109/ICSJ.2012.6523389
DO - 10.1109/ICSJ.2012.6523389
M3 - Conference contribution
AN - SCOPUS:84879753143
SN - 9781467326551
T3 - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
BT - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
T2 - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
Y2 - 10 December 2012 through 12 December 2012
ER -