TY - JOUR
T1 - Room-temperature microjoining of LSI chips on poly(ethylene naphthalate) film using mechanical caulking of Au cone bump
AU - Shuto, Takanori
AU - Watanabe, Naoya
AU - Ikeda, Akihiro
AU - Asano, Tanemasa
PY - 2012/4
Y1 - 2012/4
N2 - We show that room-temperature bonding of LSI chips on a resin film made of poly(ethylene naphthalate) (PEN) can be realized by using mechanical caulking of a cone-shaped bump electrode made of Au. A 20-μm-pitch area array of cone-shaped Au bumps was fabricated on a Si wafer by photolithography and electroplating. The counter electrode with cross-shaped slits on the PEN film was composed of a Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by electroless plating on patterned Al. Bonding of about 10,000 bump connections with 184mΩ/bump has been achieved at room temperature.
AB - We show that room-temperature bonding of LSI chips on a resin film made of poly(ethylene naphthalate) (PEN) can be realized by using mechanical caulking of a cone-shaped bump electrode made of Au. A 20-μm-pitch area array of cone-shaped Au bumps was fabricated on a Si wafer by photolithography and electroplating. The counter electrode with cross-shaped slits on the PEN film was composed of a Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by electroless plating on patterned Al. Bonding of about 10,000 bump connections with 184mΩ/bump has been achieved at room temperature.
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U2 - 10.1143/JJAP.51.04DB04
DO - 10.1143/JJAP.51.04DB04
M3 - Article
AN - SCOPUS:84860377529
SN - 0021-4922
VL - 51
JO - Japanese journal of applied physics
JF - Japanese journal of applied physics
IS - 4 PART 2
M1 - 04DB04
ER -