Room-temperature hermetic sealing by ultrasonic bonding with Au compliant rim

Ryo Takigawa; Keiichiro Iwanabe; Takanori Shuto; Takayuki Takao; Tanemasa Asano

doi:10.7567/JJAP.53.06JM05

Room-temperature hermetic sealing by ultrasonic bonding with Au compliant rim

Ryo Takigawa, Keiichiro Iwanabe, Takanori Shuto, Takayuki Takao, Tanemasa Asano

Integrated Electronic Systems

Research output: Contribution to journal › Article › peer-review

19 Citations (Scopus)

Abstract

We newly introduce a compliant rim to realize hermetic sealing of electronic components at low temperature. The compliant rim easily deforms under pressing load owing to its cone-shaped cross section and, therefore, intermetallic bonding can be performed at low temperature. We demonstrate the room-temperature vacuum sealing using the compliant rim made of Au with the aid of ultrasonic vibration of submicron amplitude. A test vehicle fabricated using silicon and glass showed that the air leak rate of the room-temperature sealing was well below 1 × 10^-12 Pa.m³/s, which is sufficiently low for use in vacuum packaging.

Original language	English
Article number	06JM05
Journal	Japanese journal of applied physics
Volume	53
Issue number	6 SPEC. ISSUE
DOIs	https://doi.org/10.7567/JJAP.53.06JM05
Publication status	Published - Jun 2014

All Science Journal Classification (ASJC) codes

Engineering(all)
Physics and Astronomy(all)

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10.7567/JJAP.53.06JM05

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AU - Takao, Takayuki

AU - Asano, Tanemasa

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AB - We newly introduce a compliant rim to realize hermetic sealing of electronic components at low temperature. The compliant rim easily deforms under pressing load owing to its cone-shaped cross section and, therefore, intermetallic bonding can be performed at low temperature. We demonstrate the room-temperature vacuum sealing using the compliant rim made of Au with the aid of ultrasonic vibration of submicron amplitude. A test vehicle fabricated using silicon and glass showed that the air leak rate of the room-temperature sealing was well below 1 × 10-12 Pa.m3/s, which is sufficiently low for use in vacuum packaging.

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Room-temperature hermetic sealing by ultrasonic bonding with Au compliant rim

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All Science Journal Classification (ASJC) codes

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