TY - JOUR
T1 - Room-temperature hermetic packaging using ultrasonic cu–cu bonding with compliant rim
AU - Takigawa, Ryo
AU - Iwanabe, Keiichiro
AU - Ikeda, Akihiro
AU - Takao, Takayuki
AU - Asano, Tanemasa
N1 - Funding Information:
This study was supported in part by the A-STEP program (No. AS242Z02927J) of the Japan Science and Technology Agency (JST).
PY - 2018
Y1 - 2018
N2 - In this paper, hermetic packaging using room-temperature (RT) Cu–Cu bonding is demonstrated for microsystem packaging. The bonding of the compliant rim made of Cu to electroplated Cu was performed with ultrasonic assist at RT. Owing to the cone-shaped cross section of the compliant rim, it easily deforms under pressing load with ultrasonic assist and bonds to the counter Cu film at RT. As a result of a simple vacuum test, the air leak rate of the cavity inside the bonded sample was approximately 2 × 10−11 Pa·m3/s, which may be sufficiently low for applications of vacuum packaging of microdevices.
AB - In this paper, hermetic packaging using room-temperature (RT) Cu–Cu bonding is demonstrated for microsystem packaging. The bonding of the compliant rim made of Cu to electroplated Cu was performed with ultrasonic assist at RT. Owing to the cone-shaped cross section of the compliant rim, it easily deforms under pressing load with ultrasonic assist and bonds to the counter Cu film at RT. As a result of a simple vacuum test, the air leak rate of the cavity inside the bonded sample was approximately 2 × 10−11 Pa·m3/s, which may be sufficiently low for applications of vacuum packaging of microdevices.
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U2 - 10.18494/SAM.2018.1967
DO - 10.18494/SAM.2018.1967
M3 - Article
AN - SCOPUS:85059237071
SN - 0914-4935
VL - 30
SP - 2897
EP - 2903
JO - Sensors and Materials
JF - Sensors and Materials
IS - 12
ER -