Room-temperature Cu-Cu bonding in ambient air achieved by using cone bump

Naoya Watanabe, Tanemasa Asano

Research output: Contribution to journalArticlepeer-review

25 Citations (Scopus)


We demonstrate room-temperature Cu-Cu bonding in ambient air by using a Cu cone bump in combination with a Cu electrode with a cross- shaped slit. By wedging the Cu cone bump into the cross-shaped slit, a bonded interface that is substantially free from contaminants can be formed. The cross-shaped slit gives lower connection resistance than a simple hole. The resistance per connection was approximately 83mω.

Original languageEnglish
Article number016501
JournalApplied Physics Express
Issue number1
Publication statusPublished - Jan 2011

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)


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