Room-temperature Cu-Cu bonding in ambient air achieved by using cone bump

Naoya Watanabe; Tanemasa Asano

doi:10.1143/APEX.4.016501

Room-temperature Cu-Cu bonding in ambient air achieved by using cone bump

Naoya Watanabe, Tanemasa Asano

Integrated Electronic Systems

Research output: Contribution to journal › Article › peer-review

25 Citations (Scopus)

Abstract

We demonstrate room-temperature Cu-Cu bonding in ambient air by using a Cu cone bump in combination with a Cu electrode with a cross- shaped slit. By wedging the Cu cone bump into the cross-shaped slit, a bonded interface that is substantially free from contaminants can be formed. The cross-shaped slit gives lower connection resistance than a simple hole. The resistance per connection was approximately 83mω.

Original language	English
Article number	016501
Journal	Applied Physics Express
Volume	4
Issue number	1
DOIs	https://doi.org/10.1143/APEX.4.016501
Publication status	Published - Jan 2011

All Science Journal Classification (ASJC) codes

Engineering(all)
Physics and Astronomy(all)

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10.1143/APEX.4.016501

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title = "Room-temperature Cu-Cu bonding in ambient air achieved by using cone bump",

abstract = "We demonstrate room-temperature Cu-Cu bonding in ambient air by using a Cu cone bump in combination with a Cu electrode with a cross- shaped slit. By wedging the Cu cone bump into the cross-shaped slit, a bonded interface that is substantially free from contaminants can be formed. The cross-shaped slit gives lower connection resistance than a simple hole. The resistance per connection was approximately 83mω.",

author = "Naoya Watanabe and Tanemasa Asano",

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AB - We demonstrate room-temperature Cu-Cu bonding in ambient air by using a Cu cone bump in combination with a Cu electrode with a cross- shaped slit. By wedging the Cu cone bump into the cross-shaped slit, a bonded interface that is substantially free from contaminants can be formed. The cross-shaped slit gives lower connection resistance than a simple hole. The resistance per connection was approximately 83mω.

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Room-temperature Cu-Cu bonding in ambient air achieved by using cone bump

Abstract

All Science Journal Classification (ASJC) codes

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