Reliability analysis of adhesive for PBT-epoxy interface

Kazuo Kato, Takashi Aoki, Yasushi Okamoto, Keiji Tanaka, Atsushi Takahara

Research output: Contribution to conferencePaperpeer-review


PBT (polybutylene terephthalate) and epoxy adhesive, which both have superior heat resistance and environmental resistance, are a representative combination now being applied to many parts. Generally, PBT is annealed after molding at a temperature above the glass transition temperature to ensure dimensional stability when in use. But in this case, this process decreases the adhesive strength between PBT and epoxy. This study analyzes the adhesion degradation mechanism in this system and a countermeasure technology is proposed. Regarding this PBT-epoxy adhesion degradation mechanism, focus is placed on changes in the fracture surface, which is analyzed before and after annealing. From this analysis it becomes clear that generation of a WBL (weak boundary layer) is caused by non-crystallization and a migration of the PBT functional group on the adhesion surface layer. According to this mechanism, it is clear that control of the functional group on the surface layer and reforming of a new functional group are very effective ways to maintain adhesive strength after annealing.

Original languageEnglish
Publication statusPublished - Dec 1 2007
Event2007 World Congress - Detroit, MI, United States
Duration: Apr 16 2007Apr 19 2007


Other2007 World Congress
Country/TerritoryUnited States
CityDetroit, MI

All Science Journal Classification (ASJC) codes

  • Automotive Engineering
  • Safety, Risk, Reliability and Quality
  • Pollution
  • Industrial and Manufacturing Engineering


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