TY - JOUR
T1 - Realization of ultraflat plastic film using dressed-photon-phonon-assisted selective etching of nanoscale structures
AU - Yatsui, Takashi
AU - Nomura, Wataru
AU - Ohtsu, Motoichi
N1 - Publisher Copyright:
© 2015 Takashi Yatsui et al.
PY - 2015
Y1 - 2015
N2 - We compared dressed-photon-phonon (DPP) etching to conventional photochemical etching and, using a numerical analysis of topographic images of the resultant etched polymethyl methacrylate (PMMA) substrate, we determined that the DPP etching resulted in the selective etching of smaller scale structures in comparison with the conventional photochemical etching. We investigated the wavelength dependence of the PMMA substrate etching using an Ogas. As the dissociation energy of Ois 5.12 eV, we applied a continuous-wave (CW) He-Cd laser (λ= 325 nm, 3.81 eV) for the DPP etching and a 5th-harmonic Nd:YAG laser (λ= 213 nm, 5.82 eV) for the conventional photochemical etching. From the obtained atomic force microscope images, we confirmed a reduction in surface roughness, Ra, in both cases. However, based on calculations involving the standard deviation of the height difference function, we confirmed that the conventional photochemical etching method etched the larger scale structures only, while the DPP etching process selectively etched the smaller scale features.
AB - We compared dressed-photon-phonon (DPP) etching to conventional photochemical etching and, using a numerical analysis of topographic images of the resultant etched polymethyl methacrylate (PMMA) substrate, we determined that the DPP etching resulted in the selective etching of smaller scale structures in comparison with the conventional photochemical etching. We investigated the wavelength dependence of the PMMA substrate etching using an Ogas. As the dissociation energy of Ois 5.12 eV, we applied a continuous-wave (CW) He-Cd laser (λ= 325 nm, 3.81 eV) for the DPP etching and a 5th-harmonic Nd:YAG laser (λ= 213 nm, 5.82 eV) for the conventional photochemical etching. From the obtained atomic force microscope images, we confirmed a reduction in surface roughness, Ra, in both cases. However, based on calculations involving the standard deviation of the height difference function, we confirmed that the conventional photochemical etching method etched the larger scale structures only, while the DPP etching process selectively etched the smaller scale features.
UR - http://www.scopus.com/inward/record.url?scp=84923875983&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84923875983&partnerID=8YFLogxK
U2 - 10.1155/2015/701802
DO - 10.1155/2015/701802
M3 - Article
AN - SCOPUS:84923875983
SN - 1687-6393
VL - 2015
JO - Advances in Optical Technologies
JF - Advances in Optical Technologies
M1 - 701802
ER -