Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces

M. A.A. Mohd Salleh, S. D. McDonald, H. Yasuda, A. Sugiyama, K. Nogita

Research output: Contribution to journalArticlepeer-review

55 Citations (Scopus)


In situ observations of the reaction between solid Cu in contact with molten Sn-0.7 wt.% Cu were achieved using a synchrotron X-ray imaging technique. It was found that, upon wetting, the rapid dissolution of Cu adjacent to the solid-liquid interface was followed by near-instantaneous interfacial intermetallic compound (IMC) formation. The kinetics of IMC formation were also elucidated. The results provide direct experimental evidence of the sequence of events in the dissolution reaction and subsequent diffusion, and in particular of the growth mechanisms of the IMC layer.

Original languageEnglish
Pages (from-to)17-20
Number of pages4
JournalScripta Materialia
Publication statusPublished - Apr 15 2015
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys


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