TY - JOUR
T1 - Proposal of new polishing mechanism based on feret's diameter of contact area between polishing pad and wafer
AU - Isobe, Akira
AU - Akaji, Masatoshi
AU - Kurokawa, Shuhei
PY - 2013/12
Y1 - 2013/12
N2 - Relationships between pad surface characteristics and polishing rate are investigated. New parameter "total Feret's diameter" of contact portions is proposed as a key parameter, which shows simple correlation to the polishing rate. Feret's diameter is a projection length of a contact shape. Based on Feret's diameter, a new polishing model is proposed in which material is removed by abrasive particles existing at periphery of the pad contact portions, not on them. When a pad contact portion moves on a wafer, abrasive particles gathers at the front end of the contact portion and they remove the wafer surface material by absorbing molecules on their surface. Number of particles at contact portion is considered to be proportional to Feret's diameter.
AB - Relationships between pad surface characteristics and polishing rate are investigated. New parameter "total Feret's diameter" of contact portions is proposed as a key parameter, which shows simple correlation to the polishing rate. Feret's diameter is a projection length of a contact shape. Based on Feret's diameter, a new polishing model is proposed in which material is removed by abrasive particles existing at periphery of the pad contact portions, not on them. When a pad contact portion moves on a wafer, abrasive particles gathers at the front end of the contact portion and they remove the wafer surface material by absorbing molecules on their surface. Number of particles at contact portion is considered to be proportional to Feret's diameter.
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U2 - 10.7567/JJAP.52.126503
DO - 10.7567/JJAP.52.126503
M3 - Article
AN - SCOPUS:84892394869
SN - 0021-4922
VL - 52
JO - Japanese journal of applied physics
JF - Japanese journal of applied physics
IS - 12
M1 - 126503
ER -