Probing the interfacial adhesion strength in compositional libraries of epoxy films

Christopher M. Stafford, Jae Hyun Kim, Daisuke Kawaguchi, Gareth Royston, Martin Y.M. Chiang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)


We are developing a measurement platform, based on the edge delamination test geometry, geared towards combinatorial and high-throughput (C&HT) assessment of interfacial adhesion and reliability of epoxy films bonded to a rigid substrate. A critical parameter space to be explored is composition of the epoxy formulation. We have constructed an automated mixing and deposition system for creating discrete and continuous gradients in composition of viscous epoxy formulations. By dicing the combinatorial library into a contiguous discrete sample array, the interfacial adhesion strength can be deduced from the critical stress required to debond each film cell from the substrate. These results can be used to predict the adhesion reliability of epoxy formulations as a function of composition and applied stress.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium Proceedings
Number of pages9
Publication statusPublished - 2006
Externally publishedYes
EventCombinatorial Methods and Informatics in Materials Science - Boston, MA, United States
Duration: Nov 28 2005Dec 1 2005

Publication series

NameMaterials Research Society Symposium Proceedings
ISSN (Print)0272-9172


OtherCombinatorial Methods and Informatics in Materials Science
Country/TerritoryUnited States
CityBoston, MA

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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