TY - GEN
T1 - Polishing mechanism of glass substrates with its processing characteristics by cerium oxide and manganese oxide slurries
AU - Yamazaki, T.
AU - Doi, T. K.
AU - Kurokawa, S.
AU - Isayama, S.
AU - Umezaki, Y.
AU - Matsukawa, Y.
AU - Kono, H.
AU - Akagami, Y.
AU - Yamaguchi, Y.
AU - Kawase, Y.
PY - 2010
Y1 - 2010
N2 - With an aim to reduce the consumption of cerium oxide (CeO2) used in large quantity for the polishing of glass substrates applied for HDD and display, we have attempted to obtain the processing characteristics of glass substrates by CeO2 slurry. We also paid attention to manganese oxide abrasives to replace cerium oxide abrasives. As a result, we have found Mn 2O3 abrasives potential to replace disappearing CeO 2 for the polishing of glass substrates.
AB - With an aim to reduce the consumption of cerium oxide (CeO2) used in large quantity for the polishing of glass substrates applied for HDD and display, we have attempted to obtain the processing characteristics of glass substrates by CeO2 slurry. We also paid attention to manganese oxide abrasives to replace cerium oxide abrasives. As a result, we have found Mn 2O3 abrasives potential to replace disappearing CeO 2 for the polishing of glass substrates.
UR - http://www.scopus.com/inward/record.url?scp=78650497740&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=78650497740&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/KEM.447-448.141
DO - 10.4028/www.scientific.net/KEM.447-448.141
M3 - Conference contribution
AN - SCOPUS:78650497740
SN - 9780878492565
T3 - Key Engineering Materials
SP - 141
EP - 145
BT - Advances in Precision Engineering
PB - Trans Tech Publications Ltd
ER -