Outer shell type 2 DOF bending manipulator using spring-link mechanism for medical applications

Jumpei Arata, Yoshitaka Saito, Hideo Fujimoto

Research output: Chapter in Book/Report/Conference proceedingConference contribution

24 Citations (Scopus)

Abstract

In recent years, robotic technology has been introduced to medical fields and many surgical robots have been presented not only in academic fields but also as commercialized products. In this paper, an outer shell type 2 DOF bending manipulator using a spring-link mechanism is presented. The mechanism was developed for a surgical robot, which can implement various surgical treatment devices inside of the manipulator. The spring-link mechanism is a simple combination of a flat spring and a rigid link with a passive joint connection. The outer shell type 2 DOF bending manipulator is composed by four spring-link mechanisms. The most unique feature of the manipulator is that these four springs are interconnected in the kinematics. Therefore, it is possible to realize a robust and backlash-free motion by taking into account the interconnections of springs such as an internal stress of the structure. In addition, by locating four spring-link mechanisms around the manipulator, it is possible to place medical devices inside of the manipulator.

Original languageEnglish
Title of host publication2010 IEEE International Conference on Robotics and Automation, ICRA 2010
Pages1041-1046
Number of pages6
DOIs
Publication statusPublished - Aug 26 2010
Externally publishedYes
Event2010 IEEE International Conference on Robotics and Automation, ICRA 2010 - Anchorage, AK, United States
Duration: May 3 2010May 7 2010

Publication series

NameProceedings - IEEE International Conference on Robotics and Automation
ISSN (Print)1050-4729

Other

Other2010 IEEE International Conference on Robotics and Automation, ICRA 2010
Country/TerritoryUnited States
CityAnchorage, AK
Period5/3/105/7/10

All Science Journal Classification (ASJC) codes

  • Software
  • Control and Systems Engineering
  • Artificial Intelligence
  • Electrical and Electronic Engineering

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