In order to evaluate strength reliability of micron size polycrystalline silicon (poly-Si) structure for MEMS, bending strength tests of cantilever beam, Weibull analysis of the strength and fracture surface analysis are performed. Recently, the importance of microelectromechanical systems (MEMS) in society is increasing, and the number of production is also increasing. The MEMS devices, which contain mechanical movement, have to maintain their reliability in face of external shock, thermal stress and residual stress from manufacturing processes. In greeting the mass production era of the MEMS, in case the material strength design of MEMS is performed, required strength data is not average value but the variation, especially minimum value assumed of the structure and material. Micron size poly-Si structure is widely employed in the MEMS such as microsensor, switching device and so on. Then, in order to evaluate strength reliability of micron size poly-Si structure, tests and analysis are performed. The specimen is made by chemical vapor deposition (CVD) process and the thickness is 3.5, 6.4 and 8.3 micrometer and the specimen has notch (stress concentration). The test specimen used for the test changed characteristics of (1)film thickness (2) stress concentration, and investigation about the influence each effect of the variation in a bending strength with fracture surface analysis are discussed.
|The Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics
|Published - 2007