Optical micro sensors integration and application

Nobutomo Morita; Renshi Sawada

doi:10.1109/ICSJ.2014.7009595

Optical micro sensors integration and application

Nobutomo Morita, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Integrating and miniaturizing optical equipment confers many advantages: low weight, low power consumption, portability, and ease to embed. However, integration and miniaturization presents difficulties because optical elements in the equipment need precise alignment and packaging. We have previously developed several types of optical micro-sensors, including micro-electromechanical systems (MEMS) blood flow sensors, micro-optical encoders, and a micro-laser Doppler velocimeter. Cavities containing empty space and mirrors, through-silicon vias, and three-dimensional electrodes enable our sensors achieve wafer-level packaging of the optical MEMS chip. We introduce the integration of our developed miniaturized optical sensors and several applications.

Original language	English
Title of host publication	IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium
Subtitle of host publication	"Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	3-6
Number of pages	4
ISBN (Electronic)	9781479961955
DOIs	https://doi.org/10.1109/ICSJ.2014.7009595
Publication status	Published - Jan 13 2015
Event	2014 4th IEEE CPMT Symposium Japan, ICSJ 2014 - Kyoto, Japan Duration: Nov 4 2014 → Nov 6 2014

Publication series

Name	IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014

Other

Other	2014 4th IEEE CPMT Symposium Japan, ICSJ 2014
Country/Territory	Japan
City	Kyoto
Period	11/4/14 → 11/6/14

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/ICSJ.2014.7009595

Cite this

Morita, N., & Sawada, R. (2015). Optical micro sensors integration and application. In IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014 (pp. 3-6). Article 7009595 (IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSJ.2014.7009595

Optical micro sensors integration and application. / Morita, Nobutomo; Sawada, Renshi.
IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014. Institute of Electrical and Electronics Engineers Inc., 2015. p. 3-6 7009595 (IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Morita, N & Sawada, R 2015, Optical micro sensors integration and application. in IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014., 7009595, IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014, Institute of Electrical and Electronics Engineers Inc., pp. 3-6, 2014 4th IEEE CPMT Symposium Japan, ICSJ 2014, Kyoto, Japan, 11/4/14. https://doi.org/10.1109/ICSJ.2014.7009595

Morita N, Sawada R. Optical micro sensors integration and application. In IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014. Institute of Electrical and Electronics Engineers Inc. 2015. p. 3-6. 7009595. (IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014). doi: 10.1109/ICSJ.2014.7009595

Morita, Nobutomo ; Sawada, Renshi. / Optical micro sensors integration and application. IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 3-6 (IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014).

@inproceedings{6ef1306e9e0149a3a71d3ae4b3c47324,

title = "Optical micro sensors integration and application",

abstract = "Integrating and miniaturizing optical equipment confers many advantages: low weight, low power consumption, portability, and ease to embed. However, integration and miniaturization presents difficulties because optical elements in the equipment need precise alignment and packaging. We have previously developed several types of optical micro-sensors, including micro-electromechanical systems (MEMS) blood flow sensors, micro-optical encoders, and a micro-laser Doppler velocimeter. Cavities containing empty space and mirrors, through-silicon vias, and three-dimensional electrodes enable our sensors achieve wafer-level packaging of the optical MEMS chip. We introduce the integration of our developed miniaturized optical sensors and several applications.",

author = "Nobutomo Morita and Renshi Sawada",

year = "2015",

month = jan,

day = "13",

doi = "10.1109/ICSJ.2014.7009595",

language = "English",

series = "IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: {"}Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics{"}, ICSJ 2014",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "3--6",

booktitle = "IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium",

address = "United States",

note = "2014 4th IEEE CPMT Symposium Japan, ICSJ 2014 ; Conference date: 04-11-2014 Through 06-11-2014",

}

TY - GEN

T1 - Optical micro sensors integration and application

AU - Morita, Nobutomo

AU - Sawada, Renshi

PY - 2015/1/13

Y1 - 2015/1/13

N2 - Integrating and miniaturizing optical equipment confers many advantages: low weight, low power consumption, portability, and ease to embed. However, integration and miniaturization presents difficulties because optical elements in the equipment need precise alignment and packaging. We have previously developed several types of optical micro-sensors, including micro-electromechanical systems (MEMS) blood flow sensors, micro-optical encoders, and a micro-laser Doppler velocimeter. Cavities containing empty space and mirrors, through-silicon vias, and three-dimensional electrodes enable our sensors achieve wafer-level packaging of the optical MEMS chip. We introduce the integration of our developed miniaturized optical sensors and several applications.

AB - Integrating and miniaturizing optical equipment confers many advantages: low weight, low power consumption, portability, and ease to embed. However, integration and miniaturization presents difficulties because optical elements in the equipment need precise alignment and packaging. We have previously developed several types of optical micro-sensors, including micro-electromechanical systems (MEMS) blood flow sensors, micro-optical encoders, and a micro-laser Doppler velocimeter. Cavities containing empty space and mirrors, through-silicon vias, and three-dimensional electrodes enable our sensors achieve wafer-level packaging of the optical MEMS chip. We introduce the integration of our developed miniaturized optical sensors and several applications.

UR - http://www.scopus.com/inward/record.url?scp=84922817006&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84922817006&partnerID=8YFLogxK

U2 - 10.1109/ICSJ.2014.7009595

DO - 10.1109/ICSJ.2014.7009595

M3 - Conference contribution

T3 - IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014

SP - 3

EP - 6

BT - IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2014 4th IEEE CPMT Symposium Japan, ICSJ 2014

Y2 - 4 November 2014 through 6 November 2014

ER -

Optical micro sensors integration and application

Abstract

Publication series

Other

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this