On-Chip 300-GHz-Band Power Combining with Arrayed InGaAs UTC-PDs and Corporate-Fed 2×2 MPA on SiC Substrate for Wireless Communication
- Ming Che
- , Yoshiki Kamiura
- , Ryo Doi
- , Hussein Ssali
- , Hiroki Agemori
- , Bo Li
- , Kazutoshi Kato
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
6
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(Scopus)