Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn-Cu-Ni lead-free solder alloys

Kazuhiro Nogita; Tetsuro Nishimura

doi:10.1016/j.scriptamat.2008.03.002

Nickel-stabilized hexagonal (Cu, Ni)₆Sn₅ in Sn-Cu-Ni lead-free solder alloys

Kazuhiro Nogita, Tetsuro Nishimura

Research output: Contribution to journal › Article › peer-review

166 Citations (Scopus)

Abstract

Cu₆Sn₅ is an important intermetallic compound (IMC) in lead-free solder alloys. Cu₆Sn₅ exists in two crystal structures with an allotropic transformation from monoclinic η′-Cu₆Sn₅ at temperatures lower than 186 °C to hexagonal η-Cu₆Sn₅. A detailed analysis by transmission electron microscopy (TEM) in Sn-0.7 wt.% Cu-0.06 wt.% Ni reveals that when the Ni content in (Cu, Ni)₆Sn₅ is ∼9 at.% Ni, the hexagonal allotrope of (Cu, Ni)₆Sn₅ becomes stable at room temperature.

Original language	English
Pages (from-to)	191-194
Number of pages	4
Journal	Scripta Materialia
Volume	59
Issue number	2
DOIs	https://doi.org/10.1016/j.scriptamat.2008.03.002
Publication status	Published - Jul 2008
Externally published	Yes

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Access to Document

10.1016/j.scriptamat.2008.03.002

Cite this

@article{6a253f17a9aa436f9620c7c5d54a4038,

title = "Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn-Cu-Ni lead-free solder alloys",

abstract = "Cu6Sn5 is an important intermetallic compound (IMC) in lead-free solder alloys. Cu6Sn5 exists in two crystal structures with an allotropic transformation from monoclinic η′-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. A detailed analysis by transmission electron microscopy (TEM) in Sn-0.7 wt.% Cu-0.06 wt.% Ni reveals that when the Ni content in (Cu, Ni)6Sn5 is ∼9 at.% Ni, the hexagonal allotrope of (Cu, Ni)6Sn5 becomes stable at room temperature.",

author = "Kazuhiro Nogita and Tetsuro Nishimura",

year = "2008",

month = jul,

doi = "10.1016/j.scriptamat.2008.03.002",

language = "English",

volume = "59",

pages = "191--194",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Elsevier Limited",

number = "2",

}

TY - JOUR

T1 - Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn-Cu-Ni lead-free solder alloys

AU - Nogita, Kazuhiro

AU - Nishimura, Tetsuro

PY - 2008/7

Y1 - 2008/7

N2 - Cu6Sn5 is an important intermetallic compound (IMC) in lead-free solder alloys. Cu6Sn5 exists in two crystal structures with an allotropic transformation from monoclinic η′-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. A detailed analysis by transmission electron microscopy (TEM) in Sn-0.7 wt.% Cu-0.06 wt.% Ni reveals that when the Ni content in (Cu, Ni)6Sn5 is ∼9 at.% Ni, the hexagonal allotrope of (Cu, Ni)6Sn5 becomes stable at room temperature.

AB - Cu6Sn5 is an important intermetallic compound (IMC) in lead-free solder alloys. Cu6Sn5 exists in two crystal structures with an allotropic transformation from monoclinic η′-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. A detailed analysis by transmission electron microscopy (TEM) in Sn-0.7 wt.% Cu-0.06 wt.% Ni reveals that when the Ni content in (Cu, Ni)6Sn5 is ∼9 at.% Ni, the hexagonal allotrope of (Cu, Ni)6Sn5 becomes stable at room temperature.

UR - http://www.scopus.com/inward/record.url?scp=43449092170&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=43449092170&partnerID=8YFLogxK

U2 - 10.1016/j.scriptamat.2008.03.002

DO - 10.1016/j.scriptamat.2008.03.002

M3 - Article

AN - SCOPUS:43449092170

SN - 1359-6462

VL - 59

SP - 191

EP - 194

JO - Scripta Materialia

JF - Scripta Materialia

IS - 2

ER -

Nickel-stabilized hexagonal (Cu, Ni)₆Sn₅ in Sn-Cu-Ni lead-free solder alloys

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this