Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn-Cu-Ni lead-free solder alloys

Kazuhiro Nogita, Tetsuro Nishimura

Research output: Contribution to journalArticlepeer-review

166 Citations (Scopus)


Cu6Sn5 is an important intermetallic compound (IMC) in lead-free solder alloys. Cu6Sn5 exists in two crystal structures with an allotropic transformation from monoclinic η′-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. A detailed analysis by transmission electron microscopy (TEM) in Sn-0.7 wt.% Cu-0.06 wt.% Ni reveals that when the Ni content in (Cu, Ni)6Sn5 is ∼9 at.% Ni, the hexagonal allotrope of (Cu, Ni)6Sn5 becomes stable at room temperature.

Original languageEnglish
Pages (from-to)191-194
Number of pages4
JournalScripta Materialia
Issue number2
Publication statusPublished - Jul 2008
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys


Dive into the research topics of 'Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn-Cu-Ni lead-free solder alloys'. Together they form a unique fingerprint.

Cite this