TY - GEN
T1 - Negative and Positive Muon-Induced SEU Cross Sections in 28-nm and 65-nm Planar Bulk CMOS SRAMs
AU - Liao, Wang
AU - Hashimoto, Masanori
AU - Manabe, Seiya
AU - Watanabe, Yukinobu
AU - Abe, Shin Ichiro
AU - Nakano, Keita
AU - Takeshita, Hayato
AU - Tampo, Motonobu
AU - Takeshita, Soshi
AU - Miyake, Yasuhiro
N1 - Funding Information:
ACKNOWLEDGMENT This work was supported by JST OPERA and Grant-in-Aid for Scientific Research (B) from the Japan Society for the Promotion of Science under Grant 16H03906. The muon experiment for 28-nm SRAM was performed at Materials and Life Science Experimental Facility of the J-PARC under user programs No. 2017B0109.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/5/22
Y1 - 2019/5/22
N2 - In this paper, we compare the negative and positive muon-induced SEU event cross sections of 28-nm and 65-nm planar bulk CMOS SRAMs. Our measurement results show a 3.6 X increase in muon-induced SEU event cross section from 65-nm to 28-nm technology, and negative muon-induced SEU event cross section is 3.3 X larger compared to positive muons at 28-nm technology. This result is consistent with the previous works reporting muon-induced SEU event cross section increases with technology scaling. The measured result also suggests the contribution of direct ionization to the total SEU event cross section is 54.1% at 28-nm node with operating voltage of 0.6 V while it is 1.8% at 65-nm node with 0.9 V.
AB - In this paper, we compare the negative and positive muon-induced SEU event cross sections of 28-nm and 65-nm planar bulk CMOS SRAMs. Our measurement results show a 3.6 X increase in muon-induced SEU event cross section from 65-nm to 28-nm technology, and negative muon-induced SEU event cross section is 3.3 X larger compared to positive muons at 28-nm technology. This result is consistent with the previous works reporting muon-induced SEU event cross section increases with technology scaling. The measured result also suggests the contribution of direct ionization to the total SEU event cross section is 54.1% at 28-nm node with operating voltage of 0.6 V while it is 1.8% at 65-nm node with 0.9 V.
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U2 - 10.1109/IRPS.2019.8720568
DO - 10.1109/IRPS.2019.8720568
M3 - Conference contribution
AN - SCOPUS:85066743777
T3 - IEEE International Reliability Physics Symposium Proceedings
BT - 2019 IEEE International Reliability Physics Symposium, IRPS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE International Reliability Physics Symposium, IRPS 2019
Y2 - 31 March 2019 through 4 April 2019
ER -