Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces

H. Tsukamoto; Z. Dong; H. Huang; T. Nishimura; K. Nogita

Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces

H. Tsukamoto, Z. Dong, H. Huang, T. Nishimura, K. Nogita

Research output: Contribution to journal › Conference article › peer-review

Abstract

The formation of intermetallic compounds (IMCs) at solder/substrate interfaces is essential, which have a critical effect on the mechanical reliability of solder joints. In this study, nanoindentation was used to investigate elastic modulus, hardness and creep properties of the IMCs formed at the interface between Sn-Cu (-Ni) solder ball grid arrays (BGAs) and Cu substrates in multiple-reflowed samples. All the tests were conducted at room temperature. The elastic modulus and hardness of (Cu,Ni)₆Sn ₅ were higher than those of Cu₆Sn₅. The hardnesses of (Cu,Ni)₆Sn₅ were scattered, which may be attributed to the crystallographic characteristics such as a growth texture of the IMCs. The creep stress exponents of the IMCs were extremely high (9.5∼44), compared to pure tin and solder alloys.

Original language	English
Pages (from-to)	131-137
Number of pages	7
Journal	Materials Forum
Volume	34
Publication status	Published - 2008
Externally published	Yes
Event	2009 Materials and AustCeram Conference, MAC 2009 - Gold Coast, QLD, Australia Duration: Jul 1 2009 → Jul 3 2009

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Cite this

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title = "Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces",

abstract = "The formation of intermetallic compounds (IMCs) at solder/substrate interfaces is essential, which have a critical effect on the mechanical reliability of solder joints. In this study, nanoindentation was used to investigate elastic modulus, hardness and creep properties of the IMCs formed at the interface between Sn-Cu (-Ni) solder ball grid arrays (BGAs) and Cu substrates in multiple-reflowed samples. All the tests were conducted at room temperature. The elastic modulus and hardness of (Cu,Ni)6Sn 5 were higher than those of Cu6Sn5. The hardnesses of (Cu,Ni)6Sn5 were scattered, which may be attributed to the crystallographic characteristics such as a growth texture of the IMCs. The creep stress exponents of the IMCs were extremely high (9.5∼44), compared to pure tin and solder alloys.",

author = "H. Tsukamoto and Z. Dong and H. Huang and T. Nishimura and K. Nogita",

year = "2008",

language = "English",

volume = "34",

pages = "131--137",

journal = "Materials Forum",

issn = "0883-2900",

publisher = "Institute of Metals and Materials Australasia",

note = "2009 Materials and AustCeram Conference, MAC 2009 ; Conference date: 01-07-2009 Through 03-07-2009",

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TY - JOUR

T1 - Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces

AU - Tsukamoto, H.

AU - Dong, Z.

AU - Huang, H.

AU - Nishimura, T.

AU - Nogita, K.

PY - 2008

Y1 - 2008

N2 - The formation of intermetallic compounds (IMCs) at solder/substrate interfaces is essential, which have a critical effect on the mechanical reliability of solder joints. In this study, nanoindentation was used to investigate elastic modulus, hardness and creep properties of the IMCs formed at the interface between Sn-Cu (-Ni) solder ball grid arrays (BGAs) and Cu substrates in multiple-reflowed samples. All the tests were conducted at room temperature. The elastic modulus and hardness of (Cu,Ni)6Sn 5 were higher than those of Cu6Sn5. The hardnesses of (Cu,Ni)6Sn5 were scattered, which may be attributed to the crystallographic characteristics such as a growth texture of the IMCs. The creep stress exponents of the IMCs were extremely high (9.5∼44), compared to pure tin and solder alloys.

AB - The formation of intermetallic compounds (IMCs) at solder/substrate interfaces is essential, which have a critical effect on the mechanical reliability of solder joints. In this study, nanoindentation was used to investigate elastic modulus, hardness and creep properties of the IMCs formed at the interface between Sn-Cu (-Ni) solder ball grid arrays (BGAs) and Cu substrates in multiple-reflowed samples. All the tests were conducted at room temperature. The elastic modulus and hardness of (Cu,Ni)6Sn 5 were higher than those of Cu6Sn5. The hardnesses of (Cu,Ni)6Sn5 were scattered, which may be attributed to the crystallographic characteristics such as a growth texture of the IMCs. The creep stress exponents of the IMCs were extremely high (9.5∼44), compared to pure tin and solder alloys.

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M3 - Conference article

AN - SCOPUS:84875894306

SN - 0883-2900

VL - 34

SP - 131

EP - 137

JO - Materials Forum

JF - Materials Forum

T2 - 2009 Materials and AustCeram Conference, MAC 2009

Y2 - 1 July 2009 through 3 July 2009

ER -

Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces

Abstract

All Science Journal Classification (ASJC) codes

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