TY - GEN
T1 - Modeling and simulation of chemical amplification photoresist to produce high-density cone-shaped micro bumps
AU - Kumagwa, Daiki
AU - Sakamoto, Mamoru
AU - Aoki, Yohei
AU - Asano, Tanemasa
N1 - Funding Information:
The authors are grateful to Takayuki Takao for his technical assistance, This work is partially supported by CREST (Grant Number: JPMJCR1431) of JST.
Publisher Copyright:
© 2018 IEEE.
PY - 2018/12
Y1 - 2018/12
N2 - The cone-shaped micro bump provides fine-pitch room-temperature flip-chip bonding technology. It has been demonstrated to be able to connect 15 ?m-pitch 640 x 512 array pixels of an image sensor composed of a compound semiconductor photodetector array and silicon readout integrated circuit. The cone-shaped microbump is fabricated by utilizing the characteristic of the chemical amplification photoresist. For further shrinkage of the interconnection pitch below 10 ?m, not only refining of process condition but also a new design of photoresist is required. In this work, we build a model and a simulation method to investigate how the property of the photoresist and process condition determine the final shape of the cone bump.
AB - The cone-shaped micro bump provides fine-pitch room-temperature flip-chip bonding technology. It has been demonstrated to be able to connect 15 ?m-pitch 640 x 512 array pixels of an image sensor composed of a compound semiconductor photodetector array and silicon readout integrated circuit. The cone-shaped microbump is fabricated by utilizing the characteristic of the chemical amplification photoresist. For further shrinkage of the interconnection pitch below 10 ?m, not only refining of process condition but also a new design of photoresist is required. In this work, we build a model and a simulation method to investigate how the property of the photoresist and process condition determine the final shape of the cone bump.
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U2 - 10.1109/EPTC.2018.8654401
DO - 10.1109/EPTC.2018.8654401
M3 - Conference contribution
AN - SCOPUS:85091705627
T3 - 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
SP - 345
EP - 348
BT - 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th IEEE Electronics Packaging Technology Conference, EPTC 2018
Y2 - 4 December 2018 through 7 December 2018
ER -