Mn 2O 3 slurry reuse by circulation achieving high constant removal rate

Sadahiro Kishii, Ko Nakamura, Kenzo Hanawa, Satoru Watanabe, Yoshihiro Arimoto, Syuhei Kurokawa, Toshiro K. Doi

Research output: Contribution to journalArticlepeer-review


Fumed silica is widely used in SiO 2 chemical mechanical polishing (CMP). In semiconductor processes, only fresh slurry is used, and used slurry is disposed. Sustainable development demands a reduction in waste. Since reuse of slurry is effective for reducing the amount of used slurry generated, we investigated the reuse of Mn 2O 3 slurry and conventional fumed silica slurry. In both cases, abrasive concentration decreases as reuse time increases. The removal rate for Mn 2O 3 slurry maintains a value 4 times that of the conventional fumed silica slurry during slurry reuse, because the removal rate for Mn 2O 3 slurry is almost constant for solid concentrations between 1.0 and 10 wt %. Pad conditioning was not performed for Mn 2O 3 slurry. The removal rate for conventional slurry decreases as the number of times of reuse increases, even when pad conditioning is appropriately performed.

Original languageEnglish
Article number04DB07
JournalJapanese journal of applied physics
Issue number4 PART 2
Publication statusPublished - Apr 2012

All Science Journal Classification (ASJC) codes

  • General Engineering
  • General Physics and Astronomy


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