Microwave assisted spin transfer torque switching in a vertically integrated logic-in-memory architecture

H. Yu, X. Ya, T. Tanaka, K. Matsuyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Current information devices will be confronted with a serious physical limit in the lateral downsizing in the future. An alternative approach for continuous progress in the device performance is intensively demanded. An integration of multi functionality, such as memory and logic components, is a promising solution for an increasing requirement in various system applications [1,2]. In the present study, an exchange coupled multilayer stack, was proposed as a quarterly state logic-in-memory structure, and fundamental device operations have been numerically demonstrated with micromagnetic simulations.

Original languageEnglish
Title of host publication2015 IEEE International Magnetics Conference, INTERMAG 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479973224
DOIs
Publication statusPublished - Jul 14 2015
Event2015 IEEE International Magnetics Conference, INTERMAG 2015 - Beijing, China
Duration: May 11 2015May 15 2015

Publication series

Name2015 IEEE International Magnetics Conference, INTERMAG 2015

Other

Other2015 IEEE International Magnetics Conference, INTERMAG 2015
Country/TerritoryChina
CityBeijing
Period5/11/155/15/15

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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