Microstructure control in Sn-0.7 mass% Cu alloys

Kazuhiro Nogita; Jonathan Read; Tetsuro Nishimura; Keith Sweatman; Shoichi Suenaga; Arne K. Dahle

doi:10.2320/matertrans.46.2419

Microstructure control in Sn-0.7 mass% Cu alloys

Kazuhiro Nogita, Jonathan Read, Tetsuro Nishimura, Keith Sweatman, Shoichi Suenaga, Arne K. Dahle

Research output: Contribution to journal › Article › peer-review

48 Citations (Scopus)

Abstract

Soldering alloys based on the Sn-Cu alloy system are amongst the most favourable lead-free alternatives due to a range of attractive properties. Trace additions of Ni have been found to significantly improve the soldering characteristics of these alloys (reduced bridging etc.). This paper examines the mechanisms underlying the improvement in soldering properties of Sn-0.7 mass%Cu eutectic alloys modified with concentrations of Ni ranging from 0 to 1000 ppm. The alloys were investigated by thermal analysis during solidification, as well as optical/SEM microanalyses of fully solidified samples and samples quenched during solidification. It is concluded that Ni additions dramatically alter the nucleation patterns and solidification behaviour of the Sn-Cu₆Sn₅ eutectic and that these changes are related to the superior soldering characteristics of the Ni-modified Sn-0.7 mass%Cu alloys.

Original language	English
Pages (from-to)	2419-2425
Number of pages	7
Journal	Materials Transactions
Volume	46
Issue number	11
DOIs	https://doi.org/10.2320/matertrans.46.2419
Publication status	Published - Nov 2005
Externally published	Yes

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.2320/matertrans.46.2419

Cite this

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abstract = "Soldering alloys based on the Sn-Cu alloy system are amongst the most favourable lead-free alternatives due to a range of attractive properties. Trace additions of Ni have been found to significantly improve the soldering characteristics of these alloys (reduced bridging etc.). This paper examines the mechanisms underlying the improvement in soldering properties of Sn-0.7 mass%Cu eutectic alloys modified with concentrations of Ni ranging from 0 to 1000 ppm. The alloys were investigated by thermal analysis during solidification, as well as optical/SEM microanalyses of fully solidified samples and samples quenched during solidification. It is concluded that Ni additions dramatically alter the nucleation patterns and solidification behaviour of the Sn-Cu6Sn5 eutectic and that these changes are related to the superior soldering characteristics of the Ni-modified Sn-0.7 mass%Cu alloys.",

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AU - Nogita, Kazuhiro

AU - Read, Jonathan

AU - Nishimura, Tetsuro

AU - Sweatman, Keith

AU - Suenaga, Shoichi

AU - Dahle, Arne K.

PY - 2005/11

Y1 - 2005/11

N2 - Soldering alloys based on the Sn-Cu alloy system are amongst the most favourable lead-free alternatives due to a range of attractive properties. Trace additions of Ni have been found to significantly improve the soldering characteristics of these alloys (reduced bridging etc.). This paper examines the mechanisms underlying the improvement in soldering properties of Sn-0.7 mass%Cu eutectic alloys modified with concentrations of Ni ranging from 0 to 1000 ppm. The alloys were investigated by thermal analysis during solidification, as well as optical/SEM microanalyses of fully solidified samples and samples quenched during solidification. It is concluded that Ni additions dramatically alter the nucleation patterns and solidification behaviour of the Sn-Cu6Sn5 eutectic and that these changes are related to the superior soldering characteristics of the Ni-modified Sn-0.7 mass%Cu alloys.

AB - Soldering alloys based on the Sn-Cu alloy system are amongst the most favourable lead-free alternatives due to a range of attractive properties. Trace additions of Ni have been found to significantly improve the soldering characteristics of these alloys (reduced bridging etc.). This paper examines the mechanisms underlying the improvement in soldering properties of Sn-0.7 mass%Cu eutectic alloys modified with concentrations of Ni ranging from 0 to 1000 ppm. The alloys were investigated by thermal analysis during solidification, as well as optical/SEM microanalyses of fully solidified samples and samples quenched during solidification. It is concluded that Ni additions dramatically alter the nucleation patterns and solidification behaviour of the Sn-Cu6Sn5 eutectic and that these changes are related to the superior soldering characteristics of the Ni-modified Sn-0.7 mass%Cu alloys.

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Microstructure control in Sn-0.7 mass% Cu alloys

Abstract

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