Metal-Assisted chemical etching using silica nanoparticle for the fabrication of a silicon nanowire array

Shinya Kato; Yuya Watanabe; Yasuyoshi Kurokawa; Akira Yamada; Yoshimi Ohta; Yusuke Niwa; Masaki Hirota

doi:10.1143/JJAP.51.02BP09

Metal-Assisted chemical etching using silica nanoparticle for the fabrication of a silicon nanowire array

Shinya Kato, Yuya Watanabe, Yasuyoshi Kurokawa, Akira Yamada, Yoshimi Ohta, Yusuke Niwa, Masaki Hirota

Research output: Contribution to journal › Article › peer-review

26 Citations (Scopus)

Abstract

30-nm-diameter silica nanoparticles with a carboxyl radical (COO ^-) were successfully dispersed on an amino-treated silicon wafer at about 20 nm intervals owing to the repulsion among nanoparticles with negative charges. The dispersed silica nanoparticles were used as the mask for the preparation of silicon nanowire (SiNW) arrays by metal-assisted chemical etching (MAE). The diameter of the prepared SiNWs was approximately 30nm from their transmission electron microscope image.

Original language	English
Article number	02BP09
Journal	Japanese journal of applied physics
Volume	51
Issue number	2 PART 2
DOIs	https://doi.org/10.1143/JJAP.51.02BP09
Publication status	Published - Feb 2012
Externally published	Yes

All Science Journal Classification (ASJC) codes

Engineering(all)
Physics and Astronomy(all)

Access to Document

10.1143/JJAP.51.02BP09

Cite this

@article{9d32b911314448fc8e2dcfc5e3a1b77a,

title = "Metal-Assisted chemical etching using silica nanoparticle for the fabrication of a silicon nanowire array",

abstract = "30-nm-diameter silica nanoparticles with a carboxyl radical (COO -) were successfully dispersed on an amino-treated silicon wafer at about 20 nm intervals owing to the repulsion among nanoparticles with negative charges. The dispersed silica nanoparticles were used as the mask for the preparation of silicon nanowire (SiNW) arrays by metal-assisted chemical etching (MAE). The diameter of the prepared SiNWs was approximately 30nm from their transmission electron microscope image.",

author = "Shinya Kato and Yuya Watanabe and Yasuyoshi Kurokawa and Akira Yamada and Yoshimi Ohta and Yusuke Niwa and Masaki Hirota",

year = "2012",

month = feb,

doi = "10.1143/JJAP.51.02BP09",

language = "English",

volume = "51",

journal = "Japanese journal of applied physics",

issn = "0021-4922",

publisher = "The Japan Society of Applied Physics",

number = "2 PART 2",

}

TY - JOUR

T1 - Metal-Assisted chemical etching using silica nanoparticle for the fabrication of a silicon nanowire array

AU - Kato, Shinya

AU - Watanabe, Yuya

AU - Kurokawa, Yasuyoshi

AU - Yamada, Akira

AU - Ohta, Yoshimi

AU - Niwa, Yusuke

AU - Hirota, Masaki

PY - 2012/2

Y1 - 2012/2

N2 - 30-nm-diameter silica nanoparticles with a carboxyl radical (COO -) were successfully dispersed on an amino-treated silicon wafer at about 20 nm intervals owing to the repulsion among nanoparticles with negative charges. The dispersed silica nanoparticles were used as the mask for the preparation of silicon nanowire (SiNW) arrays by metal-assisted chemical etching (MAE). The diameter of the prepared SiNWs was approximately 30nm from their transmission electron microscope image.

AB - 30-nm-diameter silica nanoparticles with a carboxyl radical (COO -) were successfully dispersed on an amino-treated silicon wafer at about 20 nm intervals owing to the repulsion among nanoparticles with negative charges. The dispersed silica nanoparticles were used as the mask for the preparation of silicon nanowire (SiNW) arrays by metal-assisted chemical etching (MAE). The diameter of the prepared SiNWs was approximately 30nm from their transmission electron microscope image.

UR - http://www.scopus.com/inward/record.url?scp=84857495998&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84857495998&partnerID=8YFLogxK

U2 - 10.1143/JJAP.51.02BP09

DO - 10.1143/JJAP.51.02BP09

M3 - Article

AN - SCOPUS:84857495998

SN - 0021-4922

VL - 51

JO - Japanese journal of applied physics

JF - Japanese journal of applied physics

IS - 2 PART 2

M1 - 02BP09

ER -

Metal-Assisted chemical etching using silica nanoparticle for the fabrication of a silicon nanowire array

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this