Abstract
Micro-machining and fine-assembling technologies functionally merge the monolithic formation process of opto-electronic semiconductors and dielectric materials. This paper describes (1) circular parallel beam conversion from the elliptical emission of a laser diode using a microlens and an adjustment free assembly method using an optical fiber guide formed on the laser substrate, (2) a micro-pump that finely controls the removal of liquid for an optical cross connection using a planner waveguides with narrow grooves where the light paths are switched to transmission or reflection by a refractive index matching liquid, and (3) fine assembling technology of a laser diode array using a laser position sensor.
Original language | English |
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Pages (from-to) | 1115-1124 |
Number of pages | 10 |
Journal | NTT R and D |
Volume | 42 |
Issue number | 9 |
Publication status | Published - 1993 |
Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering