Mechaphotonics device technology

Akinori Watabe, Jun ichi Shimada, Renshi Sawada, Hiroshi Nakada

Research output: Contribution to journalArticlepeer-review


Micro-machining and fine-assembling technologies functionally merge the monolithic formation process of opto-electronic semiconductors and dielectric materials. This paper describes (1) circular parallel beam conversion from the elliptical emission of a laser diode using a microlens and an adjustment free assembly method using an optical fiber guide formed on the laser substrate, (2) a micro-pump that finely controls the removal of liquid for an optical cross connection using a planner waveguides with narrow grooves where the light paths are switched to transmission or reflection by a refractive index matching liquid, and (3) fine assembling technology of a laser diode array using a laser position sensor.

Original languageEnglish
Pages (from-to)1115-1124
Number of pages10
JournalNTT R and D
Issue number9
Publication statusPublished - 1993
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering


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