Measurement of thermal conductivity and thermal diffusivity of solid materials using a novel stamp sensor: A feasibility study with numerical analysis
- Syamsul Hadi
- , Mamoru Nishitani
- , Agung Tri Wijayanta
- , Kosaku Kurata
- , Hiroshi Takamatsu
Research output: Contribution to journal › Article › peer-review
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(Scopus)