Low-temperature LD direct bonding for highly functional optical MEMS

Engineering

• Low-Temperature 100%
• Si Substrate 100%
• Chip Bonding 100%
• Cavity Surface 100%
• Surfaces 50%
• Shear Strength 50%
• Lower Temperature 50%
• Ambient Air 50%
• Surface Activation 50%
• Radio Frequency 50%
• Failure Criterion 50%
• Bonding Process 50%
• Direct Bonding 50%
• Bonding Temperature 50%

Physics

• Microelectromechanical System 100%
• Surface Emitting Lasers 100%
• Electrodes 50%
• Ambient Air 50%
• Plasma Frequencies 50%
• Shear Strength 50%