Low-Temperature Growth of Thin Silicon Nitride Film by Electron Cyclotron Resonance Plasma Irradiation

Liwei Zhao, Nam Hoai Luu, Dong Wang, Youhei Sugimoto, Ken Ichi Ikeda, Hideheru Nakashima, Hiroshi Nakashima

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


An amorphous silicon nitride thin film has been fabricated by electron cyclotron resonance plasma irradiation. The growth of the film is carried out by Ar/N2 mixed plasma irradiation at a low temperature of 400°C. It is found that nitrogen partial pressure decisively affects film quality. A SiN film having a structure nearest to stoichiometric construction is obtained by precisely controlling the N2 mixing ratio at 60%. This implies that the existence of Ar with a suitable partial pressure increases the nitrogen radical concentration in the Ar/N2 mixed plasma. Under optimum conditions, the as-grown SiN film shows a leakage current more than two orders of magnitude lower than that of thermally grown SiO2 having the same equivalent oxide thickness. A high-resolution transmission electron micrograph shows an atomically flat interface of the Si substrate and SiN film.

Original languageEnglish
Pages (from-to)L47-L49
JournalJapanese Journal of Applied Physics
Issue number1 A/B
Publication statusPublished - Jan 15 2004

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)


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