Skip to main navigation Skip to search Skip to main content

Low temperature direct bonding of flip-chip mounting VCSEL to Si substrate

  • T. Imamura
  • , E. Higurashi
  • , T. Suga
  • , R. Sawada

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    Fingerprint

    Dive into the research topics of 'Low temperature direct bonding of flip-chip mounting VCSEL to Si substrate'. Together they form a unique fingerprint.
    Sort by

    Engineering

    Physics