TY - JOUR
T1 - Local conductivity and electric field analysis of Ag-based conductive adhesive by transmission electron microscopy
AU - Kawamoto, N.
AU - Murakami, Y.
AU - Shindo, D.
N1 - Funding Information:
The authors are grateful to Dr. T. Kan and Mr. S. Watanabe, Fujikura Kasei Co., Ltd. for providing them with Ag-based conductive adhesive samples. This work was supported by Global COE Program “Materials Integration International Center of Education and Research, Tohoku University,” MEXT, and the program “Post-Silicon Materials and Devices Research Alliance” from MEXT, Japan. This study was also supported by a Grant-in-Aid for JSPS Fellows (N. K.), Scientific Research (S), and Scientific Research (B) from the Japan Society for Promotion of Science. The authors would also like to thank the support from NEDO grant for the project “Development of Alternatives to High-Temperature Lead Solders.”
PY - 2010
Y1 - 2010
N2 - The conduction mechanism in Ag-based conductive adhesive, which has attracted the attention of researchers, has been intensively studied by the in situ observations of transmission electron microscopy (TEM) and by using special methods that employ the use of microprobes; Ag-based conductive adhesive is considered as an alternative to Pb-free solders. A current versus voltage (I-V) curve measured by using a microscope exhibited peculiar fluctuations, which implied an irreversible change in the internal structure of a cured adhesive. TEM observations showed a local shape change in Ag agglomerations, such as the formation of small horns, in a sample that was subjected to a large electric current of 1 μA. Electron holography data, which revealed the inhomogeneous distribution of equipotential lines in the sample, also implied an essential role of morphological change in the conduction properties of Ag-based conductive adhesive.
AB - The conduction mechanism in Ag-based conductive adhesive, which has attracted the attention of researchers, has been intensively studied by the in situ observations of transmission electron microscopy (TEM) and by using special methods that employ the use of microprobes; Ag-based conductive adhesive is considered as an alternative to Pb-free solders. A current versus voltage (I-V) curve measured by using a microscope exhibited peculiar fluctuations, which implied an irreversible change in the internal structure of a cured adhesive. TEM observations showed a local shape change in Ag agglomerations, such as the formation of small horns, in a sample that was subjected to a large electric current of 1 μA. Electron holography data, which revealed the inhomogeneous distribution of equipotential lines in the sample, also implied an essential role of morphological change in the conduction properties of Ag-based conductive adhesive.
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U2 - 10.1063/1.3305637
DO - 10.1063/1.3305637
M3 - Article
AN - SCOPUS:77749283491
SN - 0021-8979
VL - 107
JO - Journal of Applied Physics
JF - Journal of Applied Physics
IS - 4
M1 - 044309
ER -