Abstract
Cu6Sn5 is an important intermetallic compound used in lead-free soldering and anode materials for Li-ion batteries. Cu 6Sn5 exists in at least two crystal structures, with a transformation from hexagonal η-Cu6Sn5 at temperatures higher than ∼186 °C to monoclinic η′-Cu6Sn 5 at lower temperatures. Using variable temperature synchrotron X-ray diffraction analysis, the kinetics of the η-η′ transformation are investigated and a time-temperature transformation diagram is partially developed. The significance of the results in terms of phase and dimensional stability in solder joints are discussed.
Original language | English |
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Pages (from-to) | 922-925 |
Number of pages | 4 |
Journal | Scripta Materialia |
Volume | 65 |
Issue number | 10 |
DOIs | |
Publication status | Published - Nov 1 2011 |
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics