TY - JOUR
T1 - Intermetallic formation and fluidity in Sn-Rich Sn-Cu-Ni alloys
AU - Gourlay, C. M.
AU - Nogita, K.
AU - Read, J.
AU - Dahle, A. K.
N1 - Funding Information:
The authors would like to thank Nihon Superior Co., Ltd., for funding and for their assistance in this research, producing the Sn-10Cu and Sn-10Ni master alloys, and conducting XRF spectroscopy on a large number of samples. We also thank Mr. Sreekanth Raghunath for conducting many of the fluidity experiments. C.M.G. thanks the Royal Academy of Engineering for a RAEng/EPSRC Research Fellowship.
PY - 2010/1
Y1 - 2010/1
N2 - This paper investigates the phase equilibria and solidification behavior of Sn-Cu-Ni alloys with compositions in the range of 0 wt.% to 1.5 wt.% Cu and 0 wt.% to 0.3 wt.% Ni. The isothermal section at 268°C in the Sn-rich corner was determined. No evidence for a ternary phase was found, and the section is in good agreement with past experimental studies that report wide solubility ranges for (Cu,Ni) 6Sn 5 and (Ni,Cu) 3Sn 4. The vacuum fluidity test was applied to compositions that are liquid at 268°C to map the variation in microstructure and flow behavior with composition in this system. Significant variations in fluidity length were measured among the Sn-Cu-Ni alloys, and the variations correlate with the microstructure that develops during solidification. The generated fluidity map enables the selection of Sn-Cu-Ni solder compositions that exhibit good fluidity behavior during solidification and form near-eutectic microstructures.
AB - This paper investigates the phase equilibria and solidification behavior of Sn-Cu-Ni alloys with compositions in the range of 0 wt.% to 1.5 wt.% Cu and 0 wt.% to 0.3 wt.% Ni. The isothermal section at 268°C in the Sn-rich corner was determined. No evidence for a ternary phase was found, and the section is in good agreement with past experimental studies that report wide solubility ranges for (Cu,Ni) 6Sn 5 and (Ni,Cu) 3Sn 4. The vacuum fluidity test was applied to compositions that are liquid at 268°C to map the variation in microstructure and flow behavior with composition in this system. Significant variations in fluidity length were measured among the Sn-Cu-Ni alloys, and the variations correlate with the microstructure that develops during solidification. The generated fluidity map enables the selection of Sn-Cu-Ni solder compositions that exhibit good fluidity behavior during solidification and form near-eutectic microstructures.
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U2 - 10.1007/s11664-009-0962-5
DO - 10.1007/s11664-009-0962-5
M3 - Article
AN - SCOPUS:74449086197
SN - 0361-5235
VL - 39
SP - 56
EP - 69
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 1
ER -