Influence of wafer edge profile on STI-CMP process performance (examination based on surface pressure of wafer calculated by FEM analysis)

Engineering

• Chemical Mechanical Polishing 50%
• Contact Pressure 50%
• Polishing Process 50%
• Shallow Trench Isolation 50%
• Semiconductor Manufacturing 33%
• Edge Exclusion 33%
• Surfaces 16%
• Performance 16%
• Surface Pressure 16%
• Calculates 16%
• Removal Rate 16%
• Satisfies 16%
• Requirements 16%
• Effective Approach 16%
• Process Performance 16%
• Bellow 16%

Physics

• Wafer 100%
• Width 50%
• Finite Element Modeling 50%
• Roll 33%
• Performance 16%
• Pressure 16%

Material Science

• Surface 16%