In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy

Xin F. Tan; Flora Somidin; Stuart D. McDonald; Michael J. Bermingham; Hiroshi Maeno; Syo Matsumura; Kazuhiro Nogita

doi:10.3390/ma15020510

In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy

Xin F. Tan, Flora Somidin, Stuart D. McDonald, Michael J. Bermingham, Hiroshi Maeno, Syo Matsumura, Kazuhiro Nogita

Quantum Sciences of Materials

Research output: Contribution to journal › Article › peer-review

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Abstract

The complex reaction between liquid solder alloys and solid substrates has been studied ex-situ in a few studies, utilizing creative setups to “freeze” the reactions at different stages during the reflow soldering process. However, full understanding of the dynamics of the process is difficult due to the lack of direct observation at micro-and nano-meter resolutions. In this study, high voltage transmission electron microscopy (HV-TEM) is employed to observe the morphological changes that occur in Cu6Sn5 between a Sn-3.0 wt%Ag-0.5 wt%Cu (SAC305) solder alloy and a Cu substrate in situ at temperatures above the solidus of the alloy. This enables the continuous surveillance of rapid grain boundary movements of Cu6Sn5 during soldering and increases the fundamental understanding of reaction mechanisms in solder solid/liquid interfaces.

Original language	English
Article number	510
Journal	Materials
Volume	15
Issue number	2
DOIs	https://doi.org/10.3390/ma15020510
Publication status	Published - Jan 1 2022

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics

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10.3390/ma15020510

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title = "In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy",

abstract = "The complex reaction between liquid solder alloys and solid substrates has been studied ex-situ in a few studies, utilizing creative setups to “freeze” the reactions at different stages during the reflow soldering process. However, full understanding of the dynamics of the process is difficult due to the lack of direct observation at micro-and nano-meter resolutions. In this study, high voltage transmission electron microscopy (HV-TEM) is employed to observe the morphological changes that occur in Cu6Sn5 between a Sn-3.0 wt%Ag-0.5 wt%Cu (SAC305) solder alloy and a Cu substrate in situ at temperatures above the solidus of the alloy. This enables the continuous surveillance of rapid grain boundary movements of Cu6Sn5 during soldering and increases the fundamental understanding of reaction mechanisms in solder solid/liquid interfaces.",

author = "Tan, {Xin F.} and Flora Somidin and McDonald, {Stuart D.} and Bermingham, {Michael J.} and Hiroshi Maeno and Syo Matsumura and Kazuhiro Nogita",

note = "Funding Information: Funding: This work was supported by the University of Queensland (UQ) [UQ-KU project], Nihon Superior [2016001895], the Australian Research Council [DP200101949], MEXT Japan [JPMXP09-A-17-KU-224], and Kyushu University [Progress 100 program]. Publisher Copyright: {\textcopyright} 2022 by the authors. Licensee MDPI, Basel, Switzerland.",

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doi = "10.3390/ma15020510",

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AU - Bermingham, Michael J.

AU - Maeno, Hiroshi

AU - Matsumura, Syo

AU - Nogita, Kazuhiro

N1 - Funding Information: Funding: This work was supported by the University of Queensland (UQ) [UQ-KU project], Nihon Superior [2016001895], the Australian Research Council [DP200101949], MEXT Japan [JPMXP09-A-17-KU-224], and Kyushu University [Progress 100 program]. Publisher Copyright: © 2022 by the authors. Licensee MDPI, Basel, Switzerland.

PY - 2022/1/1

Y1 - 2022/1/1

N2 - The complex reaction between liquid solder alloys and solid substrates has been studied ex-situ in a few studies, utilizing creative setups to “freeze” the reactions at different stages during the reflow soldering process. However, full understanding of the dynamics of the process is difficult due to the lack of direct observation at micro-and nano-meter resolutions. In this study, high voltage transmission electron microscopy (HV-TEM) is employed to observe the morphological changes that occur in Cu6Sn5 between a Sn-3.0 wt%Ag-0.5 wt%Cu (SAC305) solder alloy and a Cu substrate in situ at temperatures above the solidus of the alloy. This enables the continuous surveillance of rapid grain boundary movements of Cu6Sn5 during soldering and increases the fundamental understanding of reaction mechanisms in solder solid/liquid interfaces.

AB - The complex reaction between liquid solder alloys and solid substrates has been studied ex-situ in a few studies, utilizing creative setups to “freeze” the reactions at different stages during the reflow soldering process. However, full understanding of the dynamics of the process is difficult due to the lack of direct observation at micro-and nano-meter resolutions. In this study, high voltage transmission electron microscopy (HV-TEM) is employed to observe the morphological changes that occur in Cu6Sn5 between a Sn-3.0 wt%Ag-0.5 wt%Cu (SAC305) solder alloy and a Cu substrate in situ at temperatures above the solidus of the alloy. This enables the continuous surveillance of rapid grain boundary movements of Cu6Sn5 during soldering and increases the fundamental understanding of reaction mechanisms in solder solid/liquid interfaces.

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In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy

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