In situ imaging of microstructure formation in electronic interconnections

M. A.A.Mohd Salleh; C. M. Gourlay; J. W. Xian; S. A. Belyakov; H. Yasuda; S. D. McDonald; K. Nogita

doi:10.1038/srep40010

In situ imaging of microstructure formation in electronic interconnections

M. A.A.Mohd Salleh, C. M. Gourlay, J. W. Xian, S. A. Belyakov, H. Yasuda, S. D. McDonald, K. Nogita

Faculty of Engineering

Research output: Contribution to journal › Article › peer-review

42 Citations (Scopus)

Abstract

The development of microstructure during melting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has been studied by synchrotron radiography. Using Sn-3.0Ag-0.5Cu/Cu and Sn-0.7Cu/Cu as examples, we show that the interfacial Cu₆Sn₅layer is present within 0.05 s of wetting, and explore the kinetics of flux void formation at the interface between the liquid and the Cu₆Sn₅ layer. Quantification of the nucleation locations and anisotropic growth kinetics of primary Cu₆Sn₅crystals reveals a competition between the nucleation of Cu₆Sn₅in the liquid versus growth of Cu₆ Sn₅from the existing Cu₆ Sn₅ layer. Direct imaging confirms that the β-Sn nucleates at/near the Cu₆Sn₅layer in Sn-3.0Ag-0.5Cu/Cu joints.

Original language	English
Article number	40010
Journal	Scientific reports
Volume	7
DOIs	https://doi.org/10.1038/srep40010
Publication status	Published - Jan 12 2017

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@article{056c48cbdfd943e89d38f7113f27a8d5,

title = "In situ imaging of microstructure formation in electronic interconnections",

abstract = "The development of microstructure during melting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has been studied by synchrotron radiography. Using Sn-3.0Ag-0.5Cu/Cu and Sn-0.7Cu/Cu as examples, we show that the interfacial Cu6Sn5layer is present within 0.05 s of wetting, and explore the kinetics of flux void formation at the interface between the liquid and the Cu6Sn5 layer. Quantification of the nucleation locations and anisotropic growth kinetics of primary Cu6Sn5crystals reveals a competition between the nucleation of Cu6Sn5in the liquid versus growth of Cu6 Sn5from the existing Cu6 Sn5 layer. Direct imaging confirms that the β-Sn nucleates at/near the Cu6Sn5layer in Sn-3.0Ag-0.5Cu/Cu joints.",

author = "Salleh, {M. A.A.Mohd} and Gourlay, {C. M.} and Xian, {J. W.} and Belyakov, {S. A.} and H. Yasuda and McDonald, {S. D.} and K. Nogita",

note = "Publisher Copyright: {\textcopyright} The Author(s) 2017.",

year = "2017",

month = jan,

day = "12",

doi = "10.1038/srep40010",

language = "English",

volume = "7",

journal = "Scientific reports",

issn = "2045-2322",

publisher = "Nature Publishing Group",

}

TY - JOUR

T1 - In situ imaging of microstructure formation in electronic interconnections

AU - Salleh, M. A.A.Mohd

AU - Gourlay, C. M.

AU - Xian, J. W.

AU - Belyakov, S. A.

AU - Yasuda, H.

AU - McDonald, S. D.

AU - Nogita, K.

PY - 2017/1/12

Y1 - 2017/1/12

N2 - The development of microstructure during melting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has been studied by synchrotron radiography. Using Sn-3.0Ag-0.5Cu/Cu and Sn-0.7Cu/Cu as examples, we show that the interfacial Cu6Sn5layer is present within 0.05 s of wetting, and explore the kinetics of flux void formation at the interface between the liquid and the Cu6Sn5 layer. Quantification of the nucleation locations and anisotropic growth kinetics of primary Cu6Sn5crystals reveals a competition between the nucleation of Cu6Sn5in the liquid versus growth of Cu6 Sn5from the existing Cu6 Sn5 layer. Direct imaging confirms that the β-Sn nucleates at/near the Cu6Sn5layer in Sn-3.0Ag-0.5Cu/Cu joints.

AB - The development of microstructure during melting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has been studied by synchrotron radiography. Using Sn-3.0Ag-0.5Cu/Cu and Sn-0.7Cu/Cu as examples, we show that the interfacial Cu6Sn5layer is present within 0.05 s of wetting, and explore the kinetics of flux void formation at the interface between the liquid and the Cu6Sn5 layer. Quantification of the nucleation locations and anisotropic growth kinetics of primary Cu6Sn5crystals reveals a competition between the nucleation of Cu6Sn5in the liquid versus growth of Cu6 Sn5from the existing Cu6 Sn5 layer. Direct imaging confirms that the β-Sn nucleates at/near the Cu6Sn5layer in Sn-3.0Ag-0.5Cu/Cu joints.

UR - http://www.scopus.com/inward/record.url?scp=85009382009&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85009382009&partnerID=8YFLogxK

U2 - 10.1038/srep40010

DO - 10.1038/srep40010

M3 - Article

AN - SCOPUS:85009382009

SN - 2045-2322

VL - 7

JO - Scientific reports

JF - Scientific reports

M1 - 40010

ER -

In situ imaging of microstructure formation in electronic interconnections

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