Improved Carrier Mobility of Sn-Doped Ge Thin-Films (≤50 nm) by Interface-Modulated Solid-Phase Crystallization Combined with Thinning

Masanori Chiyozono, Xiangsheng Gong, Taizoh Sadoh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A technique to obtain high carrier mobility of Sn-doped Ge thin-films (thickness ≤50 nm) on insulator is proposed. The carrier mobilities of Ge films grown by interface-modulated solid-phase crystallization decrease with decreasing deposition thickness. From crystal structure analysis, it is revealed that decrease in the grain sizes with decreasing deposition thickness causes the decrease of the mobilities. To solve this problem, we propose thinning of grown films (deposition thickness: 50 nm) by etching. This achieves high carrier mobility (170 cm2/Vs) even for thin-films (thickness: 20 nm). This technique will be useful to realize advanced fully-depleted devices for next-generation electronics.

Original languageEnglish
Title of host publicationProceedings of AM-FPD 2020 - 27th International Workshop on Active-Matrix Flatpanel Displays and Devices
Subtitle of host publicationTFT Technologies and FPD Materials
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages75-76
Number of pages2
ISBN (Electronic)9784990875398
DOIs
Publication statusPublished - Sept 2020
Event27th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, AM-FPD 2020 - Virtual, Kyoto, Japan
Duration: Sept 1 2020Sept 4 2020

Publication series

NameProceedings of AM-FPD 2020 - 27th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials

Conference

Conference27th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, AM-FPD 2020
Country/TerritoryJapan
CityVirtual, Kyoto
Period9/1/209/4/20

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Media Technology
  • Electronic, Optical and Magnetic Materials

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