Hybrid integration technologies for optical micro-systems

E. Higurashi, T. Itoh, T. Suga, R. Sawada

    Research output: Contribution to journalConference articlepeer-review


    Flip-chip bonding of various optical components (laser diode, photodiode, grating, etc) on a silicon substrate by passive optical alignment, which eliminates complicated optical axis precise alignment, has opened up many new possibilities in constructing highly functional, reliable, and low-cost optical micro-systems. Using this technique, several micro-sensors (< 2 × 3 mm2), including a blood flow sensor that can monitor blood flow in human skin, and a high-resolution encoder that can measure displacements or revolution angles, have been developed. Moreover, for future optical micro-systems, a novel method of a low temperature flip-chip bonding using surface activated bonding process has been introduced.

    Original languageEnglish
    Article number09
    Pages (from-to)67-73
    Number of pages7
    JournalProceedings of SPIE - The International Society for Optical Engineering
    Publication statusPublished - 2004
    EventOptomechatronic Micro/Nano Components, Devices, and Systems - Philadelphia, PA, United States
    Duration: Oct 27 2004Oct 28 2004

    All Science Journal Classification (ASJC) codes

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Computer Science Applications
    • Applied Mathematics
    • Electrical and Electronic Engineering


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