Hybrid integration of LiNbO 3 thin films on micromachined Si substrates using room-temperature transfer bonding

R. Takigawa; E. Higurashi; T. Suga; T. Kawanishi

doi:10.1109/LTB-3D.2012.6238064

Hybrid integration of LiNbO ₃ thin films on micromachined Si substrates using room-temperature transfer bonding

R. Takigawa
, E. Higurashi
, T. Suga
, T. Kawanishi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Hybrid integration of high-quality lithium niobate (LiNbO ₃) single-crystal thin films (<5 μm) on micromachined Si substrates has been demonstrated using room-temperature flip-chip transfer bonding based on surface-activated bonding with Au microbumps.

Original language	English
Title of host publication	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Pages	105
Number of pages	1
DOIs	https://doi.org/10.1109/LTB-3D.2012.6238064
Publication status	Published - 2012
Externally published	Yes
Event	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan Duration: May 22 2012 → May 23 2012

Publication series

Name	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Other

Other	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Country/Territory	Japan
City	Tokyo
Period	5/22/12 → 5/23/12

All Science Journal Classification (ASJC) codes

Computer Graphics and Computer-Aided Design
Computer Vision and Pattern Recognition

Access to Document

10.1109/LTB-3D.2012.6238064

Cite this

Takigawa, R., Higurashi, E., Suga, T., & Kawanishi, T. (2012). Hybrid integration of LiNbO ₃ thin films on micromachined Si substrates using room-temperature transfer bonding. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 (pp. 105). Article 6238064 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). https://doi.org/10.1109/LTB-3D.2012.6238064

Hybrid integration of LiNbO ₃ thin films on micromachined Si substrates using room-temperature transfer bonding. / Takigawa, R.; Higurashi, E.; Suga, T. et al.
Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 105 6238064 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Takigawa, R, Higurashi, E, Suga, T & Kawanishi, T 2012, Hybrid integration of LiNbO ₃ thin films on micromachined Si substrates using room-temperature transfer bonding. in Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012., 6238064, Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, pp. 105, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, Tokyo, Japan, 5/22/12. https://doi.org/10.1109/LTB-3D.2012.6238064

Takigawa R, Higurashi E, Suga T, Kawanishi T. Hybrid integration of LiNbO ₃ thin films on micromachined Si substrates using room-temperature transfer bonding. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 105. 6238064. (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). doi: 10.1109/LTB-3D.2012.6238064

Takigawa, R. ; Higurashi, E. ; Suga, T. et al. / Hybrid integration of LiNbO ₃ thin films on micromachined Si substrates using room-temperature transfer bonding. Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. pp. 105 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

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