High-speed photoreceivers using solder bumps and microstrip lines formed on a silicon optical bench

Yuji Akahori; Takaharu Ohyama; Takashi Yamada; Kazutoshi Katoh; Toshio Ito

doi:10.1109/68.752546

High-speed photoreceivers using solder bumps and microstrip lines formed on a silicon optical bench

Yuji Akahori, Takaharu Ohyama, Takashi Yamada, Kazutoshi Katoh, Toshio Ito

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

High-speed photoreceiver modules using silicon optical benches are described. These modules employ solder bumps for chip assembly and microstrip lines for electrical signal transmission. The assembly and wiring technologies are the same as those used in the planar lightwave circuit platforms we developed. A photoreceiver module consisting of a waveguide photodiode showed a very wide bandwidth greater than 20 GHz, and together with a spotsize-converted semiconductor optical amplifier, operated as an optical preamplifier that showed good receiver sensitivity of -20.3 dBm at 10 Gb/s nonreturn-to-zero.

Original language	English
Pages (from-to)	454-456
Number of pages	3
Journal	IEEE Photonics Technology Letters
Volume	11
Issue number	4
DOIs	https://doi.org/10.1109/68.752546
Publication status	Published - Apr 1999
Externally published	Yes

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Electrical and Electronic Engineering

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10.1109/68.752546

Cite this

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abstract = "High-speed photoreceiver modules using silicon optical benches are described. These modules employ solder bumps for chip assembly and microstrip lines for electrical signal transmission. The assembly and wiring technologies are the same as those used in the planar lightwave circuit platforms we developed. A photoreceiver module consisting of a waveguide photodiode showed a very wide bandwidth greater than 20 GHz, and together with a spotsize-converted semiconductor optical amplifier, operated as an optical preamplifier that showed good receiver sensitivity of -20.3 dBm at 10 Gb/s nonreturn-to-zero.",

author = "Yuji Akahori and Takaharu Ohyama and Takashi Yamada and Kazutoshi Katoh and Toshio Ito",

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AU - Akahori, Yuji

AU - Ohyama, Takaharu

AU - Yamada, Takashi

AU - Katoh, Kazutoshi

AU - Ito, Toshio

PY - 1999/4

Y1 - 1999/4

N2 - High-speed photoreceiver modules using silicon optical benches are described. These modules employ solder bumps for chip assembly and microstrip lines for electrical signal transmission. The assembly and wiring technologies are the same as those used in the planar lightwave circuit platforms we developed. A photoreceiver module consisting of a waveguide photodiode showed a very wide bandwidth greater than 20 GHz, and together with a spotsize-converted semiconductor optical amplifier, operated as an optical preamplifier that showed good receiver sensitivity of -20.3 dBm at 10 Gb/s nonreturn-to-zero.

AB - High-speed photoreceiver modules using silicon optical benches are described. These modules employ solder bumps for chip assembly and microstrip lines for electrical signal transmission. The assembly and wiring technologies are the same as those used in the planar lightwave circuit platforms we developed. A photoreceiver module consisting of a waveguide photodiode showed a very wide bandwidth greater than 20 GHz, and together with a spotsize-converted semiconductor optical amplifier, operated as an optical preamplifier that showed good receiver sensitivity of -20.3 dBm at 10 Gb/s nonreturn-to-zero.

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High-speed photoreceivers using solder bumps and microstrip lines formed on a silicon optical bench

Abstract

All Science Journal Classification (ASJC) codes

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