Abstract
We developed a multi-hollow discharge plasma chemical vapor deposition (CVD) method to deposit a-Si:H films of high stability against light exposure for solar cell applications. This method suppresses incorporation of clusters, which are formed in discharges, into films; and such a-Si:H films without cluster incorporation show high stability against light exposure. Aiming at increasing the deposition rate, we have developed a honeycomb type electrode with more than double number of holes, and we have realized deposition of highly stable a-Si:H films of 4.7×1015cm-3 in stabilized defect density at a rate of 3.0nm/s and better film thickness uniformity within 5% in an area of 4cm in diameter.
| Original language | English |
|---|---|
| Pages (from-to) | S241-S245 |
| Journal | Surface and Coatings Technology |
| Volume | 205 |
| Issue number | SUPPL. 1 |
| DOIs | |
| Publication status | Published - Dec 25 2010 |
All Science Journal Classification (ASJC) codes
- General Chemistry
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Materials Chemistry
Fingerprint
Dive into the research topics of 'High rate deposition of highly stable a-Si:H films using multi-hollow discharges for thin films solar cells'. Together they form a unique fingerprint.Cite this
- APA
- Standard
- Harvard
- Vancouver
- Author
- BIBTEX
- RIS