Abstract
A novel wide-band flip-chip technique is proposed, where optimized wide-gap coplanar waveguides are used to reduce the discontinuity. The flip-chip technique made it possible to achieve the return loss of over 28 dB up to 60 GHz.
Original language | English |
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Pages | 207-209 |
Number of pages | 3 |
Publication status | Published - 1996 |
Externally published | Yes |
Event | Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging - Napa Valley, CA, USA Duration: Oct 28 1996 → Oct 30 1996 |
Other
Other | Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging |
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City | Napa Valley, CA, USA |
Period | 10/28/96 → 10/30/96 |
All Science Journal Classification (ASJC) codes
- Engineering(all)